EDA Tools Software Engineer

Intel Corporation•Hillsboro, OR

3d•$149,600 - $211,200•Hybrid

About The Position

Intel Foundry Technology Manufacturing’s Advanced Packaging Technology and Manufacturing group is seeking a CAD/EDA Tools Software Engineer to help develop, test, debug, and improve software tools, design flows, and methodologies used by internal and Foundry package design teams. The role works with design engineers, CAD teams, infrastructure partners, and EDA vendors to improve engineering productivity, user experience, and design efficiency. The ideal candidate has expertise in Cadence Advanced Package Design (APD) tools, SKILL, and large-scale automation using package design tools. The position is based in Phoenix, Arizona, with an additional location in Hillsboro, Oregon, and is eligible for Intel’s hybrid work model. It is an experienced-hire role and is not eligible for Intel immigration sponsorship. The posted annual US salary range is $149,600–$211,200, with pay determined by location and other relevant factors.

Requirements

Bachelor’s degree in Computer Science, Electrical Engineering, Computer Engineering, Software Development, Software Engineering, or a STEM-related field.
At least 4 years of experience in IC digital design, package design, or EDA tools.
At least 4 years of experience with EDA tools from vendors such as Cadence, Synopsys, or Siemens; examples include Cadence Virtuoso, Innovus, Synopsys 3DIC Compiler, and Siemens Calibre.
At least 4 years of experience using scripting languages such as Python, TCL, SKILL, VBScript, or Perl to automate workflows.
At least 4 years of experience interfacing with customers and stakeholders to analyze design challenges or define functional specifications for EDA vendors.
Customer-oriented mindset, self-direction, results orientation, and ability to manage multiple tasks.
Teamwork and analytical problem-solving skills.
Effective communication, collaboration, listening, and feedback skills.

Nice To Haves

Master’s degree in Computer Science, Electrical Engineering, or a related STEM field.
At least 6 years of experience in IC digital design, package design, or EDA tools.
Experience with computational geometry, silicon or assembly processes, or test and characterization techniques.
Experience with large SoC or multi-die package design implementation flows.
Scripting and automation experience in EDA environments.
Experience supporting Design Automation, CAD, or package design environments.
Demonstrated ability to lead cross-functional infrastructure and automation improvement initiatives.

Responsibilities

Troubleshoot and resolve user issues involving EDA tools, internal automation, engineering environments, infrastructure, and design-flow execution.
Partner with engineering teams to gather requirements, identify pain points, improve design flows, and deploy new features.
Collaborate with internal design, reliability, and CAD teams and external EDA vendors to resolve technical issues and define and implement tool features and requirements.
Develop technical documentation, user guides, and best-known methods to improve design efficiency, flows, and package design methodologies.
Communicate effectively with diverse engineering and design teams and a large end-user community.
Build and execute test cases for debugging, validation, and tool signoffs.
Create and verify package designs, integrating components into hierarchical systems for end-to-end EDA tool testing of advanced technologies.