DMTS Process Development Engineer, Advanced Packaging

Micron • Boise, ID

1d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will lead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration.

Requirements

• MS in Chemistry, Chemical Engineering, Materials Science, or related field (or equivalent experience)
• 15+ years in semiconductor process development, manufacturing, or advanced packaging
• Deep expertise in wafer‑level or die‑level processes such as CMP, etch, cleans, thin films, lithography, hybrid bonding, TCB, dicing, or molding
• Strong understanding of semiconductor process integration and materials interactions
• Proven experience leading complex cross‑functional technical programs

Nice To Haves

• PhD in a relevant technical field
• Extensive experience with advanced memory technologies or 3D packaging architectures
• Experience mentoring other engineers and driving technical methodology improvements
• Familiarity with materials characterization and simulation (thermal, mechanical, electrical)

Responsibilities

• Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness
• Develop and mature novel process flows, materials, and integration schemes that meet electrical, mechanical, thermal, cost, and reliability needs
• Lead FOAK development, supplier engagement, and ecosystem collaboration to close capability gaps and accelerate learning
• Drive structured problem solving for multi‑domain technical challenges and guide strategic decisions across programs
• Lead technology transfer to manufacturing and influence packaging and integration decisions across product teams
• Expected to leverage AI-enabled tools, automation, data analytics, and advanced modeling methods to accelerate process development, strengthen decision-making, and improve technical outcomes across advanced packaging programs.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior