Director Analyst - Semiconductor Foundry and Advanced Packaging

Gartner • Foxborough, MA

2d • Hybrid

About The Position

As part of Gartner’s Emerging Market Dynamics Group, the Director Analyst equips leaders in the semiconductor industry with research, advice, and tools to address mission-critical priorities. The role owns the quantitative and market-intelligence view of global foundry and advanced packaging capacity, technology transitions, and economics, translating manufacturing constraints into implications for semiconductor supply and competitive strategy. Analysts deliver insights through published research and frequent client interactions, including phone calls, videoconferences, Gartner events, and sales-support visits.

The position develops and maintains market forecasts and models covering foundry capacity, wafer demand, utilization, revenue, market share, and economics, as well as advanced-packaging capacity, throughput, technology mix, suppliers, and revenue. It monitors suppliers, process-node transitions, fab expansions, capital expenditure, pricing, customer allocations, and constraints across foundries, HBM, substrates, OSAT/test, and advanced packaging. The analyst assesses how device and infrastructure trends affect wafer and packaging demand, identifies emerging bottlenecks, and explains their implications for availability, pricing, and competitive positioning.

The role supports client inquiries and produces differentiated research for executive, market-intelligence, and strategic audiences. It collaborates with analysts covering adjacent semiconductor and infrastructure topics and participates in Gartner research communities. The role’s coverage is focused on the manufacturing-market and quantitative aspects of foundry and advanced packaging; it does not own GPU/CPU/ASIC competitive strategy, HBM/DRAM forecasts, semiconductor equipment markets, or end-to-end AI infrastructure strategy, but it quantifies how these adjacent markets translate into wafer, node, and packaging demand.

Requirements

• 10–12+ years of experience in semiconductor foundry, advanced packaging, manufacturing strategy, market intelligence, product planning, or industry research.
• BE/BTech from a Grade A engineering college, specializing in Electronics, Semiconductors, or Software Engineering.
• Strong knowledge of semiconductor process technology, capacity planning, and advanced packaging.
• Understanding of foundry economics, yield, utilization, node migration, and customer allocation.
• Experience building quantitative market models and forecasts.
• Familiarity with TSMC, Samsung, Intel Foundry, GlobalFoundries, UMC, SMIC, ASE, Amkor, and other major ecosystem participants.
• Ability to connect manufacturing detail with market, competitive, and financial implications.
• Ability to design, develop, and maintain large Excel models for market-share analysis and forecasting; strong working knowledge of Microsoft Word and PowerPoint.
• Strong written and verbal communication skills, including the ability to state and justify positions with facts, provide actionable analysis and recommendations, and explain complex concepts concisely.
• Strong analytical, critical-thinking, estimation, and problem-solving skills; ability to think creatively, independently, and efficiently and to produce original analysis.
• Ability to manage time, keep projects on schedule, resolve issues, and deliver client work in a timely manner.
• Ability to build professional relationships and client trust, engage with varied client organization types and seniority levels, and represent Gartner research and methodologies to Board, C-level, business-unit, and operational audiences.
• Ability to organize effectively, drive results, collaborate productively, and coach and develop colleagues where required.
• Professional maturity, intellectual curiosity, integrity, adaptability, ownership, and willingness to follow internal processes and policies.
• Awareness of issues across IT, technology, semiconductor, and electronics industries affecting software technologies and the competitive landscape, with eagerness to learn.

Nice To Haves

• Graduate degree and MBA in Marketing or Operations from leading A- and B-schools.
• Prior experience with speaking engagements.
• Ability and willingness to coach and develop colleagues where required.

Responsibilities

• Develop and maintain forecasts for global foundry capacity, wafer demand, utilization, revenue, and market share.
• Track leading-edge and mature-node capacity across TSMC, Samsung, Intel Foundry, GlobalFoundries, UMC, SMIC, and other relevant suppliers.
• Analyze process-node migration, fab expansions, capital expenditure, utilization, pricing, and customer allocation.
• Maintain market intelligence on advanced packaging technologies, including 2.5D/3D integration, CoWoS-class packaging, chiplets, hybrid bonding, fan-out, and advanced substrates.
• Quantify advanced-packaging capacity, throughput, utilization, supplier share, and technology migration.
• Track interactions among foundry, HBM, substrates, OSAT/test, and advanced-packaging constraints.
• Analyze how AI accelerators, custom ASICs, CPUs, GPUs, and other high-performance devices translate into wafer and packaging demand.
• Monitor customer and supplier relationships, capacity commitments, geographic expansion, and semiconductor localization strategies.
• Maintain quarterly trackers, forecasts, supplier databases, and scenario models.
• Identify emerging capacity bottlenecks and assess implications for availability, pricing, and competitive positioning.
• Support client inquiries and produce differentiated research for VP, market-intelligence, and strategic audiences.
• Collaborate with analysts covering AI accelerators, memory, semiconductor equipment, interconnect, and infrastructure economics.
• Participate in Gartner global research communities and knowledge-sharing sessions.
• Present and explain research and recommendations to clients by phone, face-to-face, videoconference, and on stage.
• Manage projects and deliver client deliverables on schedule; collaborate with colleagues and provide or receive constructive feedback.

Benefits

• World-class benefits and highly competitive compensation.
• Disproportionate rewards for top performers.
• Hybrid work flexibility, including working virtually when productive and gathering with colleagues in person.

What This Job Offers

• Job Type: Full-time
• Career Level: Director