Device Engineer

Avicena Tech•Sunnyvale, CA

About The Position

As a Device Engineer at Avicena, you will drive the design, fabrication, electro-optical characterization and qualification of GaN microLED devices at the heart of our LightBundle™ interconnect platform. You will translate device physics into manufacturable, high-yield emitters that meet aggressive targets for efficiency, speed, and array uniformity, working across the full stack from epitaxy and process integration to on-wafer test.

Requirements

Education: MS or PhD in Electrical Engineering, Applied Physics, Materials Science, Photonics, or a related field (or BS with equivalent industry experience).
Experience: 5–8+ years of hands-on experience in semiconductor optoelectronic or LED/laser device engineering.
Device fundamentals: Strong grasp of compound-semiconductor device physics, including carrier transport, recombination, and optical emission.
Characterization: Proven expertise in electro-optical device characterization and data analysis (L-I-V, spectral, high-speed/modulation measurements).
Process fluency: Working knowledge of semiconductor fabrication processes (lithography, etch, deposition, metallization) and their impact on device performance.
Tools: Proficiency with data analysis and scripting tools (e.g., Python, MATLAB) and TCAD or equivalent device simulation.

Nice To Haves

GaN microLEDs: Prior hands-on experience with GaN-based microLED devices is strongly preferred but not required.
High-speed / high-bandwidth LED or VCSEL device experience for optical interconnect or display applications.
Experience with large-area or high-density emitter arrays and array-level uniformity/yield.
Familiarity with heterogeneous integration or hybrid bonding to CMOS.
Track record of patents or peer-reviewed publications in optoelectronic devices.

Responsibilities

Device design & modeling: Develop and optimize GaN-based microLED device structures, including epitaxial layer stacks, active regions, and contact schemes, using TCAD and analytical models to hit efficiency, bandwidth, current-density and reliability targets.
Fabrication & integration: Define and refine process flows in collaboration with process integration and foundry partners; own device-level design-of-experiments from wafer to characterization.
Electro-optical characterization: Design and execute L-I-V, spectral, modulation-bandwidth, and reliability-relevant measurements on single devices and large arrays; correlate results to design and process parameters.
Performance improvement: Diagnose loss mechanisms (non-radiative recombination, sidewall effects, current crowding) and drive design/process changes to improve wall-plug efficiency and high-speed performance.
Cross-functional collaboration: Partner with epitaxy, process, packaging, test, and systems teams to align device performance with link-level and product requirements.
Documentation: Establish device specifications, test plans, and technical reports; contribute to IP generation and internal design reviews.