The Department of Mechanical Engineering at the Pennsylvania State University in University Park is seeking applications for a tenure-line position at the Assistant or Associate Professor level. The focus of this role is on solutions for thermal management in large-scale electronics packaging, including modeling and/or experiments related to electro-mechanical-thermal management of electronics applications. This position is crucial for addressing the challenges posed by the growth of data centers and high-capacity computing in the AI revolution, impacting energy supply, climate, system reliability, and economics. The role aligns with a new center at Penn State dedicated to semiconductor innovation and is co-funded by the Department of Mechanical Engineering and the Materials Research Institute. The Department of Mechanical Engineering is a large department with over 65 faculty, 350 graduate students, and 1110 undergraduate students, conducting significant funded research across various fields. Penn State supports interdisciplinary research through university-level institutes focused on materials, health, and energy. The Department offers comprehensive degree programs in mechanical engineering, including online graduate programs. The Materials Research Institute (MRI) is a university-wide institute fostering interdisciplinary research to solve complex materials challenges.
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Job Type
Full-time
Career Level
Entry Level
Education Level
Ph.D. or professional degree