The Department of Mechanical Engineering at the Pennsylvania State University in University Park is seeking applications for a tenure-line position at the Assistant or Associate Professor level. This role focuses on solutions for thermal management in large-scale electronics packaging, including modeling and experimental exploration of electro-mechanical-thermal management for various electronics applications, particularly those relevant to data centers and high-capacity computing. The position aligns with a new center at Penn State dedicated to semiconductor innovation and is co-funded by the Department of Mechanical Engineering and the Materials Research Institute. The department is a large, research-intensive unit with extensive graduate and undergraduate programs, actively fostering interdisciplinary research through university-level institutes. The Materials Research Institute (MRI) supports interdisciplinary teams addressing complex materials challenges.
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Job Type
Full-time
Career Level
Entry Level
Education Level
Ph.D. or professional degree