Join Intel's Advanced Packaging Team within the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA) organization, whose mission is to be the supplier of choice for leading and affordable advanced substrate packaging. APTDSWA is the leader in developing cutting edge substrate technology for Intel’s foundry business. As an APTDSWA Manufacturing Manager in Advanced Packaging Technology and Manufacturing, you will serve as a senior-level individual contributor responsible for delivering advanced packaging manufacturing deliverables, driving factory execution readiness, and enabling technology development milestones. This role requires strong ownership of operational priorities across safety, quality, output, cost, cycle time, tool readiness, WIP movement, and schedule commitments. You will partner closely with engineering, integration, planning, quality, maintenance, and program teams to resolve complex factory issues, improve manufacturing performance, and help deliver advanced packaging technologies that support Intel's continued leadership. APTDSWA Manufacturing Managers perform senior individual contributor functions associated with substrate and advanced packaging execution, including factory readiness, production execution, equipment and process alignment, operational prioritization, issue resolution, and delivery of committed manufacturing milestones.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
Job Type
Full-time
Career Level
Senior