Advanced Packaging Engineer

DensityAIMountain View, CA

About The Position

Own different aspects of Packaging including Design Layout, SI/PI and Thermo-mechanical aspects. Work with chip-design and software teams driving DensityAI's AI accelerator program from first silicon through scale-out.

Requirements

  • Exceptional abilities across the full advanced packaging design and tradeoffs
  • 10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies
  • Hands-on with industry-standard packaging tools and flows for multi-die packaging (including 2.5D/3D)
  • Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions
  • Work authorization is required at start; we provide immigration support to secure or transfer status.

Nice To Haves

  • DFT-aware packaging design, RTL and PD flows

Responsibilities

  • Own different aspects of Packaging including Design Layout, SI/PI and thermo-mechanical aspects
  • Use and develop AI-assisted tool flows to accelerate package design and signoff timelines

Benefits

  • equity grant per company guidelines
  • medical / dental / vision
  • 401(k)
  • standard PTO
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