Advanced Packaging & Integration Engineer

Cisco•San Jose, CA

About The Position

Cisco is seeking a highly capable Advanced Packaging engineer to join Cisco's Packaging Technology & Quality team within our world-class Global Supply Chain. You will be instrumental in driving advanced packaging technology development to support Cisco’s ground breaking silicon photonic technology roadmap including optical engines, co-packaged optics and on-board optics. The ideal candidate brings broad packaging technology experience and a strong curiosity to pursue innovative solutions. You will operate at the intersection of advanced technology and strategic execution, working within a highly collaborative and cross-functional environment. You will engage directly with counterparts at OSATs, foundries, and key suppliers to drive the development of innovative packaging technologies—specifically focused on heterogeneous integration—from early-stage conceptualization through qualification. This role offers significant cross-organizational visibility and the opportunity to shape critical technology roadmaps and influence long-term product platforms.

Requirements

PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or a related field.
4+ years of progressive industry experience in advanced packaging with a proven track record of successful project execution in high-density integration.
Comprehensive knowledge of advanced interconnect materials, process and assembly, including ultra-fine pitch technologies and hybrid bonding.
Hands-on experience with CAD tools such as kLayout, APD, Solidworks

Nice To Haves

Knowledge of physical failure analysis methods.
Hands-on experience with hybrid bonding and thin die/wafer processing
Working knowledge of finite element analysis
Deep understanding of next-generation substrate and PCB design and materials, and their influence on packaging performance.
Expertise in si photonic co-integration (CPO, NPO) is a plus
Proven ability to work effectively within highly multi-functional and geographically distributed technical teams.

Responsibilities

Advanced packaging technology development engineer focused on silicon photonic packaging and electronic-photonic integration, including 2.5D/3D chip stacking, heterogenous integration, and ultra-fine pitch interconnect technologies.
Drive definition, design and analysis of packaging technology test vehicles.
Drive validation of new technology against key performance metrics.
Apply deep process expertise to oversee wafer processing, fine pitch bumping, D2W/W2W hybrid bonding, fanout, advanced substrate development, and assembly.
Work with top-tier foundry and assembly partners to develop and qualify robust packaging solutions for high density photonics integration, CPO and on-board optics.
Utilize design and modeling experience to guide Design for Manufacturability (DfM) and Design for Reliability (DfR).
Identify and mitigate risks, resolving highly complex packaging issues through advanced root cause analysis and the implementation of corrective actions.

Benefits

medical, dental and vision insurance
a 401(k) plan with a Cisco matching contribution
paid parental leave
short and long-term disability coverage
basic life insurance
grants of Cisco restricted stock units
10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees
1 paid day off for employee’s birthday, paid year-end holiday shutdown, and 4 paid days off for personal wellness determined by Cisco
16 days of paid vacation time per full calendar year, accrued at rate of 4.92 hours per pay period for full-time employees (non-exempt)
flexible vacation time off program (exempt)
80 hours of sick time off provided on hire date and each January 1st thereafter, and up to 80 hours of unused sick time carried forward from one calendar year to the next
Additional paid time away may be requested to deal with critical or emergency issues for family members
Optional 10 paid days per full calendar year to volunteer
annual bonuses