Advanced Packaging & Integration Engineer

Cisco•San Jose, CA

1d•$154,900 - $225,300

About The Position

Cisco is seeking an Advanced Packaging Engineer to join its Packaging Technology & Quality team within Global Supply Chain. The role advances packaging technology for Cisco’s silicon photonic roadmap, including optical engines, co-packaged optics, and on-board optics. It focuses on heterogeneous integration and involves working with OSATs, foundries, and suppliers to develop innovative packaging technologies from early conceptualization through qualification. The position offers cross-organizational visibility and the opportunity to shape technology roadmaps and long-term product platforms.

Requirements

PhD or MS in Mechanical Engineering, Electrical Engineering, Physics, or a related field.
At least 4 years of progressive industry experience in advanced packaging, with successful project execution in high-density integration.
Comprehensive knowledge of advanced interconnect materials, processes, and assembly, including ultra-fine-pitch technologies and hybrid bonding.
Hands-on experience with CAD tools such as kLayout, APD, or Solidworks.

Nice To Haves

Knowledge of physical failure analysis methods.
Hands-on experience with hybrid bonding and thin die/wafer processing.
Working knowledge of finite element analysis.
Deep understanding of next-generation substrate and PCB design and materials, and their influence on packaging performance.
Expertise in silicon photonic co-integration, including CPO and NPO.
Ability to work effectively within highly multifunctional and geographically distributed technical teams.

Responsibilities

Develop advanced packaging technology focused on silicon photonic packaging and electronic-photonic integration, including 2.5D/3D chip stacking, heterogeneous integration, and ultra-fine-pitch interconnect technologies.
Define, design, and analyze packaging technology test vehicles and validate new technologies against key performance metrics.
Apply process expertise to oversee wafer processing, fine-pitch bumping, D2W/W2W hybrid bonding, fanout, advanced substrate development, and assembly.
Work with foundry and assembly partners to develop and qualify robust packaging solutions for high-density photonics integration, co-packaged optics, and on-board optics.
Use design and modeling experience to guide Design for Manufacturability (DfM) and Design for Reliability (DfR).
Identify and mitigate risks, resolve complex packaging issues through root cause analysis, and implement corrective actions.

Benefits

Medical, dental, and vision insurance, subject to plan eligibility rules.
401(k) plan with Cisco matching contribution.
Paid parental leave.
Short- and long-term disability coverage.
Basic life insurance.
Paid holidays and a floating holiday for non-exempt employees.
Paid birthday leave, year-end holiday shutdown, and personal wellness days.
Paid vacation or flexible vacation time off, depending on employee classification.
Sick time off and carryover of unused sick time, subject to policy.
Additional paid time away may be requested for critical or emergency family issues.
Optional paid volunteer days.
Annual bonuses for eligible non-sales employees, subject to Cisco policies.
Employees may be eligible for Cisco restricted stock unit grants.