Advanced Packaging Integration Engineer

Advanced Micro Devices, Inc•Austin, TX

About The Position

AMD is seeking an experienced Advanced Package Integration Engineer to drive package process development and product new product introduction (NPI) for EPYC server products. The role owns product and test-vehicle package planning, development, and qualification, working with internal cross-functional teams and external suppliers. It involves leading global teams to design test vehicles and product packages, develop and qualify processes, and resolve technical and schedule challenges in support of technology and product milestones. The engineer reports progress to program managers and senior leadership, and works with ecosystem partners to collect and analyze data and implement solutions. The role spans multiple disciplines and geographies and offers opportunities to influence product strategy and address high-impact technical challenges. AMD states that benefits are described in its benefits-at-a-glance materials. The role is not eligible for visa sponsorship. The posting is for an existing vacancy.

Requirements

  • Proven experience in semiconductor packaging development, especially for advanced server products.
  • Demonstrated leadership driving cross-functional projects with internal teams and external suppliers.
  • A strong problem-solving track record in yield improvement, reliability, and process development.
  • Excellent written and verbal communication skills, including the ability to present complex technical information to diverse audiences.
  • BS, MS, PhD, or equivalent in Mechanical Engineering, Material Science, Electrical Engineering, or Chemical Engineering.

Nice To Haves

  • Hands-on experience with advanced 3D and 2.5D package structures, wafer-level assembly, substrate assembly, RDL, bumping, composite materials, and polymers.
  • Experience working directly with OSATs, material and equipment suppliers, and foundry partners.
  • Experience leading global project teams and managing NPI schedules and qualifications.

Responsibilities

  • Define test-vehicle and product-package designs and create execution plans with cross-functional teams.
  • Lead technology development and product NPI, coordinating milestones across geographies and suppliers.
  • Identify technical and schedule risks, then develop and implement mitigation plans.
  • Troubleshoot and resolve issues affecting schedule, yield, reliability, and process robustness.
  • Collect, analyze, and present data to drive technical decisions and continuous improvement.
  • Communicate technical status, recommendations, and risks to program managers and senior leadership.
  • Collaborate with material and equipment suppliers, OSATs, foundries, and other ecosystem partners to enable product success.

Benefits

  • Benefits are described in AMD's benefits-at-a-glance materials; specific benefits are not listed in the posting.
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