Advanced Packaging Integration Engineer

Advanced Micro Devices, Inc•Santa Clara, CA

About The Position

AMD is seeking an experienced Advanced Package Integration Engineer to drive package process development and new product introduction (NPI) for EPYC server products. The engineer will own product and test-vehicle package development and qualification activities, working with internal cross-functional teams and external suppliers. The role involves coordinating with global teams to develop and qualify processes, resolve technical and schedule challenges, and meet technology and product milestones. The engineer will report progress to program managers and leadership and collaborate with ecosystem partners to collect and analyze data and implement effective solutions. The position offers work across multiple disciplines and geographies, with opportunities to influence product execution and solve technical challenges. AMD requires a BS, MS, PhD, or equivalent in Mechanical Engineering, Material Science, Electrical Engineering, Chemical Engineering, or a related equivalent field. This role is not eligible for visa sponsorship.

Requirements

  • Proven experience in semiconductor packaging development, especially for advanced server products.
  • Experience driving cross-functional projects with internal teams and external suppliers.
  • A strong problem-solving track record in yield improvement, reliability, and process development.
  • Excellent written and verbal communication skills, including the ability to present complex technical information to diverse audiences.
  • BS, MS, PhD, or equivalent in Mechanical Engineering, Material Science, Electrical Engineering, Chemical Engineering, or an equivalent field.

Nice To Haves

  • Hands-on experience with advanced packaging, wafer-level assembly, substrate assembly, RDL, bumping, composite materials, and polymers.
  • Experience working directly with OSATs, material and equipment suppliers, and foundry partners.
  • Experience managing NPI schedules and qualifications.

Responsibilities

  • Define test-vehicle and product-package execution plans with cross-functional teams.
  • Support technology development and product NPI, meeting key milestones with internal partners and external suppliers.
  • Identify technical and schedule risks and develop and implement mitigation plans.
  • Troubleshoot and resolve issues affecting schedule, yield, reliability, and process robustness.
  • Collect, analyze, and present data to drive technical decisions and continuous improvement.
  • Communicate technical status, recommendations, and risks to program managers and leadership.
  • Collaborate with material and equipment suppliers, OSATs, foundries, and other ecosystem partners to enable product success.
  • Own product and test-vehicle package development and qualification activities.
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