Advanced Packaging Development Engineer

Apple • Santa Clara, CA

17h

About The Position

Apple’s Advanced Packaging team is seeking an experienced Packaging Development Engineer to drive next-generation packaging integration and technology development for future products. The role leads the definition, development, and qualification of advanced 2.5D and 3D packaging technologies, including hybrid bonding, high-density interposers, fine-pitch microbumps, and Through-Silicon Vias (TSVs). The engineer works cross-functionally with silicon design, physical design, SI/PI, thermal, and manufacturing teams to guide technologies from early architecture exploration through qualification and high-volume manufacturing.

The position is responsible for advanced package integration and technology development within a cross-functional team, driving novel 2.5D/3D architectures from early concept through qualification.

Requirements

• Bachelor’s degree required.

Nice To Haves

• Strong technical background in 2.5D/3D packaging and semiconductor integration schemes, such as hybrid bonding, interposers, fine-pitch microbumps, and TSVs.
• Solid grasp of fab BEoL/MEoL interconnect processing, wafer-level packaging, and advanced assembly flows.
• Understanding of packaging materials, thermo-mechanical reliability, and chip-package interaction failure mechanisms.
• Broad systems mindset and ability to balance package-level choices against silicon, electrical, thermal, and manufacturing constraints.
• Experience utilizing layout, physical design, or modeling tools alongside engineering data analysis.
• Proven track record collaborating with and driving external foundries, OSATs, or material vendors.
• Excellent communication and collaboration skills across cross-functional hardware teams.
• B.S., M.S., or Ph.D. in Physics, Materials Science, Electrical Engineering, Mechanical Engineering, Computer Engineering, or a related technical discipline.

Responsibilities

• Lead the definition, development, and qualification of next-generation 2.5D and 3D packaging technologies.
• Drive advanced package integration and technology development within a cross-functional team.
• Guide novel 2.5D/3D architectures from early concept and architecture exploration through qualification and high-volume manufacturing.
• Collaborate with silicon design, physical design, SI/PI, thermal, and manufacturing teams.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior