3D Heterogeneous Integration Development Intern (Summer 2027)

GlobalFoundries•Malta, NY

12d•$20 - $40•Onsite

About The Position

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power-efficient and high-performance solutions for high-growth markets. GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com. Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you’ll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives. The 3D Heterogeneous Integration Development Intern will contribute to advanced packaging and process-integration development, including wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, through-silicon via/through-oxide via (TSV/TOV), and interposer technologies. The intern will work with engineering teams to conduct experiments, analyze technical data, model processes, and support daily integration and process-development activities.

Requirements

Education – At least a sophomore at time of application and actively pursuing a Bachelor’s or Master’s in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or related field through an accredited degree program during the time of internship.
Must have at least an overall 3.0 GPA and be in good academic standing.
Language Fluency - English (Written & Verbal)
Travel - Up to 10%
Ability to work at least 40 hours per week during the internship.

Nice To Haves

Prior related internship or co-op experience
Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
Strong written and verbal communication skills
Strong planning & organizational skills
Currently pursuing a PhD in Engineering or related field through an accredited degree program during the internship
Experience with advanced semiconductor packaging, semiconductor integration, hybrid bonding, TSV/TOV, interposers, design of experiments, or engineering data analysis
Availability for a six-month co-op assignment is preferred

Responsibilities

Plan and perform design of experiments (DOEs) using internal semiconductor tooling and equipment at external partners.
Analyze and interpret engineering data from experiments, process optimizations, and characterization activities.
Develop or support process models to improve understanding of advanced packaging and integration performance.
Assist engineers with daily integration, process-development, documentation, and technical problem-solving activities.
Collaborate with process, materials, equipment, characterization, and external partner teams to support project objectives.
Summarize experimental results and communicate technical findings and recommended next steps to project stakeholders.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.