Process Integration Engineer - Heterogeneous Integration Development - Santa Clara, CA

Xanadu•,

5h•$130,000 - $180,000

About The Position

Xanadu is hiring a Process Integration Engineer to work on its Fabrication Process Engineering team, helping deliver photonic quantum computing hardware. The role focuses on developing and optimizing fabrication and heterogeneous integration processes for critical integrated photonics components. The engineer will design process improvement experiments, collaborate with industrial partners and internal engineering and design teams, and use metrology and failure analysis to assess and improve process performance. The role is based in Santa Clara, California, and requires travel as needed, expected to be no more than 20%. The position offers a base salary range of $130,000–$180,000, determined by location, experience, and internal benchmarks, as well as equity and benefits.

Requirements

PhD in physics, materials science, electrical engineering, or a related field.
Experience with heterogeneous integration processes for integrated photonics and/or semiconductor applications, including some subset of micro-transfer printing (µTP), die-to-wafer bonding, wafer-to-wafer bonding, or similar processes.
Familiarity with standard semiconductor and photonics metrology and failure analysis techniques, including at least two of SEM, TEM, AFM, ellipsometry, XRR/XRD, SIMS, Raman spectroscopy, and photoluminescence.
Familiarity with functional epitaxial and crystalline materials for photonics, including III-V materials and lithium niobate.
Experience with data analysis and related software such as Python, JMP, or MATLAB.
Basic familiarity with passive and active photonic components, such as waveguides, modulators, switches, beamsplitters, resonators, and MZIs.
Strong critical-thinking skills.
Demonstrated ability to tackle challenging problems and develop innovative solutions.
Excellent communication skills and a strong sense of teamwork.

Nice To Haves

At least five years of industrial and/or academic experience optimizing heterogeneous integration processes for ultra-low-loss photonics.
Experience co-integrating high-efficiency photodiodes, lasers, or similar devices with photonic integrated circuits.
A demonstrated track record of achieving or exceeding state-of-the-art performance specifications in heterogeneously integrated photonic components.
Experience with optical and/or electro-optical characterization of heterogeneously integrated photonics components.
Experience working with and developing ultra-low-loss integrated photonics.
Experience with the full product development cycle, from R&D through volume ramping.
Experience in photonic quantum computing hardware development.
Experience coordinating with and managing external partners, including major semiconductor and photonics foundries.
Experience working in fabless companies.

Responsibilities

Design and execute process improvement experiments for heterogeneous integration of photonic components, including defining process splits and gathering and analyzing inline data.
Work with external partners to execute process development and optimization experiments for heterogeneous integration processes, including micro-transfer printing (µTP), die-to-wafer bonding, wafer-to-wafer bonding, or similar processes.
Define and execute metrology and failure analysis plans to identify and mitigate failure modes and assess process optimization results.
Regularly visit and coordinate with Xanadu’s heterogeneous integration industrial partners.
Evaluate the need for tools related to heterogeneous integration processes and conduct best-of-breed evaluations to inform tool purchase decisions.
Collaborate with internal and external photonics process engineers, process integration engineers, and photonics design engineers, including colleagues at Xanadu’s industrial partners.
Challenge the state of the art in key performance metrics for heterogeneous integration of integrated photonics components.
Keep up with developments in heterogeneous integration for integrated photonics and implement relevant new learnings and discoveries.
Travel as required; expected travel is no more than 20%.