Verification and Process Specialist

Mini-Circuits•Deer Park, NY

1d•Onsite

About The Position

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Circuits’ products are used in a range of wired and wireless communications applications. Our products are also used in detection, measurement and imaging applications, including military communication, guidance and electronic countermeasure systems, commercial, scientific, military land, sea and aircraft; automotive systems, medical systems, and industrial test equipment. Mini-Circuits’ sells its products to over 20,000 customers globally through our direct sales force, applications engineering staff, sales representatives, as well as through our extensive web site.

Requirements

Knowledge of processes and procedures for handling sensitive electronic components.
Knowledge of processes and procedures for working in a low particle count environment (i.e. in a cleanroom, under a laminar flow hood, etc.).
Knowledge of inspection criteria for microelectronic assemblies and components, including MIL-STD-883. This includes but is not limited to understanding of acceptance criteria of die attach, wire/ribbon bonding, MMIC chip-outs, etc.
Knowledge of inspection criteria for miniature solder assemblies (IPC/J-STD).
Ability to inspect against detailed assembly drawings.
Comfortable operating under a microscope for a large portion of the day.
Excellent verbal and written communication skills.
Ability to learn and accept new initiatives to improve group efficiency
Comply, understand, and support corporate safety initiatives to ensure a safe work environment
Ability and willingness to abide by Company’s Code of Conduct

Nice To Haves

Preferred associate's degree in with minimum of 5 years’ experience in similar role for industry like electronic component, semiconductor or wireless manufacturing company.

Responsibilities

Inspects integrated circuit assemblies, semiconductor wafers, and IC dies for conformance to company standards, using microscope: Reads work order to determine inspection criteria and inspect to IPC610 & MIL-STD-883.
View and inspect items according to company standards to detect defects, such as broken circuit lines, bridged circuits, misalignments, symbol errors, and missing solder.
Microscopic inspection using high‑magnification imaging, including photographic evidence and elemental material analysis.
Interfaces with micro-assembly personnel to remedy defects and advise rework.
Dispositions nonconforming in-process products.
Coordinates activities with the Engineering & MPE teams.
Performs packing of final stock materials after final inspection process.
Follows and mandates AS9100/ISO9001/ISO14001 protocols and processes
Laser cutting of manufacturing materials with preventive maintenance and controlled tracking of material expiration dates.
Calibration, verification, and documentation of ESD benches and soldering stations.
Measurement, monitoring, and recordkeeping of cleanroom particle levels
Inspection photos using high max microscope and element analysis of materials.
Perform AS/400 transactions.