Transmitter (Tx) SerDes Design Lead — 224G/448G

CienaOttawa, ON
CA$138,000 - CA$220,400

About The Position

As the global leader in high-speed connectivity, Ciena is committed to a people-first approach. Our teams enjoy a culture focused on prioritizing a flexible work environment that empowers individual growth, well-being, and belonging. We’re a technology company that leads with our humanity—driving our business priorities alongside meaningful social, community, and societal impact. Ciena’s WaveLogic family of products enables high-speed optical transmission solutions that are foundational to modern telecommunications networks. This role contributes to the continued advancement of high-speed circuit design for broadband fiber-optic systems within a vibrant team with a proven track-record of success over 30 years of evolution in high-speed circuits for broadband fiber-optic modems — the team that pioneered the world's first high-speed DAC and ADC analog macros for coherent fiber-optic products. We are looking for a hands-on Transmitter (Tx) SerDes Design Lead to design and deliver our high-speed electrical transmitter macros for 224G and 448G SerDes in the latest deep-submicron CMOS technologies.

Requirements

  • Bachelor’s degree in Electrical Engineering or Computer Engineering, or applicable scientific discipline.
  • 10+ years of industrial experience designing high-speed analog, mixed-signal, or SerDes transmitter circuits in advanced CMOS technologies, including schematic design through post-layout verification.
  • Application of transmitter circuit building blocks including DAC-based output stages, serializers or multiplexers, output drivers, and clocking circuits.
  • Execution of post-layout and extraction-based simulations to validate performance across process, voltage, and temperature conditions.
  • Delivery of analog circuit designs through silicon validation.
  • Utilization of Cadence, Mentor, or Synopsys tools including Virtuoso, Calibre, STAR-RC, and MMSIM.
  • Demonstrated written and verbal communication skills and ability to work independently and within a team environment.

Nice To Haves

  • Experience applying 224G or 448G PAM4 or PAM6 SerDes and related OIF-CEI or IEEE standards.
  • Experience contributing to transmitter architecture using MATLAB, Verilog-A, or C++.
  • Application of signal integrity, power integrity, channel, and package co-design methodologies, including use of EM tools such as HFSS or EMX.
  • Experience mentoring engineers within analog macro design teams.
  • Experience with mixed-signal validation using high-speed measurement and probing equipment.

Responsibilities

  • Own schematic-level design and post-layout verification of the transmitter signal chain and it’s blocks: DAC-based output stage, serialization, clocking interface, and output driver
  • Work closely with management, system designers, and lab validation teams to evolve the architecture and meet standard and product requirements
  • Evaluate circuit topologies and recommend implementations based on tradeoffs across power, area, bandwidth, and technology constraints.
  • Collaborate with layout and design engineers to deliver designs through full GDSII integration.
  • Drive extraction-based post-layout simulations and validate transmitter performance (bandwidth, linearity/RLM, return loss, jitter, and power) across process, voltage, and temperature conditions.
  • Own root-cause analysis of design- and post-layout performance gaps and implement the corrective design actions to meet specifications.
  • Maintain block- and transmitter-level performance and power tracking against the agreed targets.
  • Translate agreed architecture and system requirements into the transmitter implementation, and feed design and silicon learnings back to inform the next architecture step.
  • Build and use behavioral/design models (e.g., MATLAB, Verilog-A) to support topology tradeoffs and specification alignment.
  • Partner with lab validation teams to correlate silicon results with simulations and support test-chip, product bring-up and characterization.
  • Provide technical guidance and mentorship to more junior design and layout engineers, and report status and share experience with the group on a regular basis.

Benefits

  • medical, dental, and vision plans
  • participation in 401(K) (USA) & DCPP (Canada) with company matching
  • Employee Stock Purchase Program (ESPP)
  • Employee Assistance Program (EAP)
  • company-paid holidays
  • paid sick leave
  • vacation time
  • Paid Family Leave
  • other leaves of absence
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