Thermo-Mechanical Engineer - Palo Alto

Vinci • Palo Alto, CA

12h • Hybrid

About The Position

Vinci is building Physics AI for hardware design. Its software platform helps hardware designers and physics simulation engineers explore, analyze, and optimize hardware systems by bringing fast AI-based physics intelligence into engineering design workflows. The product combines the accuracy and determinism of traditional simulation with the speed and scalability of AI to support the design, verification, production, and integration of advanced semiconductors.

As part of the technical sales team, the Thermo-Mechanical Engineer will help accelerate adoption of Vinci’s software among leading engineering teams. The role involves building and simulating thermo-mechanical models based on customer designs, validating Vinci’s software, and demonstrating its value in real-world engineering applications. The engineer will use expertise in mechanical and thermo-mechanical analysis to assess warpage, stress, and reliability in electronics packages, chips, and wafer-scale devices. A strong foundation in continuum mechanics is used to analyze linear and nonlinear behavior, geometric and material nonlinearities, and contact interactions.

The role works directly with prospective and current customers to understand requirements, answer technical questions, demonstrate product capabilities, and support evaluations, onboarding, and deployment. Customer feedback also informs product development. This is a hybrid role requiring three days per week in Vinci’s Palo Alto office, with moderate travel primarily within the United States and infrequent international travel to customers and events in Asia and Europe.

Requirements

• Degree in Mechanical, Electrical, or a related engineering field.
• At least 3 years of hands-on mechanical analysis for warpage, stress, and reliability using commercial software such as Ansys, Abaqus, or LS-DYNA.
• Experience in customer-facing roles.
• Strong problem-solving mindset and ability to learn new tools and workflows quickly.
• Ability to communicate complex results clearly to mixed technical and business audiences.

Nice To Haves

• Familiarity with semiconductor electronics packaging, advanced packaging, or foundry work, including chip warpage, wafer warpage, and 2.5D/3D IC.
• Experience in pre-sales, technical sales, or customer-facing engineering roles.
• Ability to rapidly learn and adapt to new physics-based workflows and AI-assisted design tools.
• Experience commercializing technical software, ideally EDA or simulation tools, for semiconductor and electronics companies.

Responsibilities

• Engage with customer engineering teams during evaluations by supporting simulation setup, running test cases, and interpreting results to demonstrate Vinci’s value.
• Collaborate with the sales team on product demonstrations, proof-of-concept evaluations, and technical discussions with prospective customers.
• Support customer onboarding and deployments with technical guidance, training, and troubleshooting during deployment and production.
• Identify customer pain points and workflow challenges, and collaborate with product and engineering teams to improve product capabilities and the customer experience.
• Deliver technical training sessions and workshops to help customer teams adopt and scale Vinci within their engineering workflows.
• Represent Vinci at industry conferences and semiconductor events through live product demonstrations, booth activities, and technical engagement with prospective customers and partners.
• Maintain knowledge of competitive technologies, industry trends, and market positioning to communicate Vinci’s differentiators.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level