Samsung’s Power & Thermal Lab is seeking an intern to build and calibrate thermal models of high-bandwidth memory (HBM) stacks and packages. The intern will develop and validate compact thermal models that convert workload-driven power maps into transient temperature maps much faster than full CFD simulations while maintaining accuracy close to CFD. The work will support design decisions for future HBM products and involve collaboration with hardware, software, and thermal experts. The intern will work on-site daily at Samsung’s San Jose headquarters and report to the SVP, R&D (Power & Thermal Lab). The role includes modeling HBM stack and package physics, validating results against CFD, improving solver speed, simulating AI workload traces, evaluating cooling approaches, and coupling thermal models with power simulations. The position provides mentorship and hands-on experience with production-relevant projects. Applicants must have at least one academic quarter or semester remaining in their studies.
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Career Level
Intern