Intern, Power-Thermal Simulation Software Engineer

Samsung Semiconductor•San Jose, CA
•Onsite

About The Position

Samsung’s Power & Thermal Lab is seeking a software engineering intern to help develop a power and thermal simulation tool for AI memory architecture and packaging teams. The tool helps teams visualize how designs affect power consumption and heat generation without requiring physical prototypes or lengthy computations. The intern will contribute to the tool’s simulation infrastructure, user interface, power and thermal engines, and data pipeline, working with authentic data and cross-functional partners to deliver production-grade results. The role supports research and product teams across multiple projects and offers mentorship in a collaborative environment with hardware, software, and thermal experts. The position requires daily onsite presence at Samsung’s San Jose headquarters, in alignment with its Flexible Work policy, and reports to the SVP, R&D (Power & Thermal Lab).

Requirements

  • Pursuing a master’s or Ph.D. in Computer Science, Electrical and Computer Engineering, or a related major.
  • Must have at least one academic quarter or semester remaining.
  • C++ skills.
  • Experience scripting workflows in Python or Bash.
  • Experience with SystemC and/or transaction-level modeling.
  • Systems-level software-engineering skills.
  • Inclusive, adaptable approach when working with diverse people and global norms.
  • Curiosity, resilience, and an avid learning mindset.
  • Collaborative approach to building relationships, offering support, and welcoming different approaches.
  • Innovative and creative approach, with a willingness to explore ideas and adapt to change.

Nice To Haves

  • RTL design, synthesis, and analysis research and/or experience, including Verilog, SystemVerilog, or SystemC.
  • Experience with large-scale simulation or EDA/CFD-adjacent tooling environments.
  • Familiarity with discrete-event or time-stepped simulation architecture.
  • Experience with GPU, computer architecture, AI memory, memory controllers, PHYs, or high-speed I/O.

Responsibilities

  • Build automation pipelines for simulation runs, regression testing, and result tracking.
  • Implement and optimize trace-driven power-thermal simulation engines.
  • Generate transient power maps, perform spatiotemporal hotspot analysis, and interface with reduced-order or CFD-calibrated thermal solvers.
  • Develop high-fidelity RTL-, SystemC-, and C-based power macromodels for AI memory component IPs using analytical modeling, LUT, FSM, NN, and hybrid approaches.
  • Extract activity-, value-, and state-dependent power features from C, SystemC, and RTL simulations.
  • Define power-relevant functional states using transaction- or state-based abstraction.
  • Calibrate models using synthesis-assisted anchors and validate them against RTL/gate-level and silicon data.
  • Integrate IP-level power macromodels into system-level simulations.
  • Manage time-indexed simulation flows across power and thermal domains.
  • Support research and product teams across multiple projects, including end-to-end simulation, regression testing, and data-pipeline management.
  • Complete other responsibilities as assigned.

Benefits

  • Relocation stipend for employees living more than 50 miles from the new office.
  • Monthly housing stipend for summer interns signing a lease for a new place.
  • Charitable giving match and opportunities to get involved in community support.
  • On-demand emotional wellness apps and paid therapy sessions.
  • Onsite café and gym, plus virtual fitness classes.
  • Flexible work environment.
  • Medical, dental, and vision benefits.
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