About The Position

itD is seeking a Technical Program Manager II to lead flexible and rigid circuit board design releases and builds for next-generation wearable devices at a leading global technology company. The role drives hardware programs from early design through production, partnering with electrical engineers, cross-functional teams, and overseas contract manufacturers to meet schedule, quality, and yield targets. The position is remote within the United States, with West Coast candidates highly preferred, and has a stated 12-month duration. Candidates must be direct W2 workers; sponsorship is not available. The position includes end-to-end ownership of PCB fabrication, SMT and FATP builds, and supplier readiness, including direct engagement with APAC contract manufacturers and flex vendors. The role also includes internal participation in itD practice meetings, thought leadership, case studies and learning materials, Digital Transformation practice materials, networking events, and career development activities. itD describes itself as a woman- and minority-led consulting and software development firm with a collaborative, low-hierarchy culture. Its employees work with Fortune 500 companies and high-performance teams across multiple industries.

Requirements

  • At least 5 years of experience in electrical design, PCB development, or related hardware engineering roles.
  • Direct ownership of design releases for flexible circuits and multi-layer boards from early design through production.
  • Experience managing SMT and FATP builds end to end, including schedule, quality, and yield optimization.
  • Hands-on management of APAC contract manufacturers, including flex vendor engagement and supplier readiness.
  • Ability to work outside standard hours to collaborate with APAC partners.
  • Direct W2 candidacy; the company is unable to offer sponsorship.

Nice To Haves

  • Experience with wearables or consumer electronics, especially AR wearable device development.
  • Familiarity with integrating small electrical components into compact form factors.
  • Knowledge of advanced PCB fabrication techniques and materials.
  • A degree in Electrical Engineering or a related field is preferred, but not required; relevant experience is valued over formal education.
  • West Coast location is highly preferred.

Responsibilities

  • Own design releases for flexible circuits and multi-layer boards (MLBs) from early design through production.
  • Collaborate with electrical engineers and cross-functional teams to develop flexible and rigid circuit boards for compact wearable products.
  • Manage PCB fabrication end to end, from schematics and layouts through vendor approval for part fabrication.
  • Manage Surface Mount Technology (SMT) and Final Assembly, Test, and Pack (FATP) builds end to end, optimizing schedule, quality, and yield.
  • Engage directly with APAC contract manufacturers, ensuring supplier readiness and managing flex vendor relationships.
  • Track schedules, gather feedback, and highlight risks throughout the development process.
  • Coordinate with APAC partners outside standard hours as needed to keep builds on schedule.
  • Attend regular internal practice community meetings.
  • Collaborate with the itD practice team on industry thought leadership.
  • Complete client case studies and learning materials, including blogs and media material.
  • Build materials to contribute to the Digital Transformation practice.
  • Attend internal itD networking events, in person and virtual.
  • Work with leadership on career fast-track opportunities.

Benefits

  • Comprehensive medical benefits
  • Dental insurance
  • Vision insurance
  • Life insurance
  • Paid holidays
  • 401(k) plan with matching
  • Networking and career learning and development programs
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