About The Position

The Technical Engagement Manager for films, OCD and wafer geometry metrology will own KLA’s FaST engagement at a new strategic account and lead an on-site team of Customer Engagement Applications Engineers. The customer operates advanced logic and DRAM at one site and is expanding its engineering team as the fab ramps, requiring the KLA team to take on more metrology ownership than is typical. The role leads the account strategy and technical execution for SpectraShape (optical CD), SpectraFilm and Aleris (thin films), and PWG (patterned wafer geometry). It owns FaST programs from tool installation, acceptance and qualification through ramp, develops measurement strategies across front-end, middle-of-line and back-end layers, and works with the customer and KLA teams to deliver product value and resolve issues. The position also translates customer sampling plans into tool throughput and attach-rate models, supports forecasting and sales planning, represents customer needs to product and modeling teams, and hires, mentors and develops Customer Engagement Applications Engineers. The role is based on site in Austin, Texas, and requires work in a cleanroom environment and travel to KLA divisions.

Requirements

  • Master’s degree or higher in Engineering, Physics, Materials Science or a related field.
  • 5 to 10 years of semiconductor fab, process control or capital equipment experience, including optical CD or thin-film metrology.
  • Strong customer-facing experience and problem-solving skills.
  • Experience leading engineers or cross-functional technical programs.

Nice To Haves

  • Deep knowledge of optical metrology, including spectroscopic ellipsometry and reflectometry, thin-film optics, RCWA-based OCD modeling and machine-learning-assisted modeling.
  • Hands-on experience with KLA SpectraShape, SpectraFilm or Aleris and KLA modeling software such as AcuShape or equivalent.
  • Process control experience on gate-all-around or other advanced logic structures; DRAM experience is a strong plus.
  • Familiarity with hybrid and reference metrology (TEM, CD-SEM, AFM) and wafer geometry for bonding, CMP and stress control.
  • Experience taking a new fab or node from R&D through high-volume ramp.
  • Excellent communication with customer executives and engineers, and strong project management.
  • Willingness to work on site in a cleanroom environment and travel to KLA divisions.

Responsibilities

  • Define and execute the account strategy for SpectraShape, SpectraFilm, Aleris and PWG, including product penetration, share and adoption.
  • Build relationships with customer integration, module and metrology leaders and understand the customer’s process flow and roadmap.
  • Own FaST programs from tool installation, acceptance and qualification through ramp.
  • Own measurement strategy across front-end, middle-of-line and back-end layers for gate-all-around logic and DRAM.
  • Lead model development and turnaround for new layers, recipe qualification, measurement uncertainty, tool matching, correlation to reference metrology, and APC feed-forward and feedback.
  • Lead complex problem solving, risk mitigation and escalation management.
  • Translate customer sampling plans into tool throughput and attach-rate models supporting the high-volume tool forecast.
  • Work with account managers on configurations, quotes and booking plans, applying KLA sales processes such as Value/People and SPIN.
  • Represent the customer to the FaST product division and its modeling teams.
  • Collaborate with division marketing, applications and engineering, Service and Sales to deliver product value, align roadmaps and resolve issues.
  • Lead technical reviews with the customer and KLA management.
  • Hire, lead, mentor and develop Customer Engagement Applications Engineers.
  • Drive best known methods, training and knowledge transfer, including helping the customer develop its metrology capability.

Benefits

  • Medical, dental, vision, life and other voluntary benefits.
  • 401(k) with company matching.
  • Employee stock purchase program (ESPP).
  • Student debt assistance.
  • Tuition reimbursement program.
  • Development and career growth opportunities and programs.
  • Financial planning benefits.
  • Wellness benefits, including an employee assistance program (EAP).
  • Paid time off and paid company holidays.
  • Family care and bonding leave.
  • Performance incentive programs may be available.
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