Tech Proj/Prog Manager III S

Applied Materials•Santa Clara, CA

1d•$110,500 - $152,000

About The Position

Applied Materials is hiring a technology project/program manager to lead its Special Substrate Handling (SSH) product and platform efforts. SSH enables semiconductor manufacturers to handle advanced, non-standard substrates—such as warped wafers, glass carriers, stacked wafers, thick substrates, rectangular panels, and glass-core substrates—that conventional wafer automation systems cannot reliably process. The role supports evolving advanced-packaging technologies, including CoWoS, chiplets, 2.5D/3D integration, and panel-level packaging, and helps address the handling requirements of AI and high-performance computing manufacturing. The position owns SSH product vision, strategy, roadmap, and business case across business units. It brings together platform, engineering, customer, and external stakeholders to define system-level requirements, plan and execute cross-functional roadmaps, integrate SSH capabilities across product platforms, and develop growth strategies for advanced packaging and AI-driven manufacturing. The manager prepares and drives projects from conception through implementation, coordinating resources, budgets, schedules, vendors, and multifunctional teams. The role requires strategic thinking, technical credibility, program execution, and the ability to influence diverse organizations and customers, including in ambiguous environments. The ideal background includes 10 or more years in semiconductor equipment, advanced packaging, automation, systems engineering, product management, or platform development, with experience leading complex cross-business-unit initiatives from concept through customer adoption. The role is based in Santa Clara, California. It is full-time, with approximately 10% travel. Relocation is not available. The salary range is $110,500 to $152,000. Candidates may also be eligible for bonus and stock awards, as applicable.

Requirements

Deep experience in semiconductor equipment, automation, robotics, substrate handling, or system integration.
Ability to operate as a Product Manager, Systems Architect, and Program Manager.
Technical credibility with engineering teams and ability to influence senior business leaders and customers.
Understanding of advanced-packaging technologies, AI/HPC market trends, and manufacturing challenges associated with non-standard substrates.
Ability to drive alignment across diverse organizations without direct authority.
Comfort engaging directly with leading-edge customers and ecosystem partners to define future technology requirements.
Strong strategic thinking, business acumen, and execution discipline.
Ability to thrive in ambiguous environments where cross-functional leadership and systems thinking are critical.
Ideal background: 10+ years in semiconductor equipment, advanced packaging, automation, systems engineering, product management, or platform development, with a proven record of leading complex cross-business-unit initiatives from concept through customer adoption.

Responsibilities

Prepare project plans and drive projects from conception and planning through implementation; contribute to developing strategies, processes, and resources.
Manage project schedules and task details using project management tools, reports, tracking charts, checklists, and scheduling software.
Coordinate divisional resources to meet project performance objectives on time and within budget; initiate and manage purchase requisitions and purchase orders.
Drive equipment cost and schedule performance for internal and external customers and vendors worldwide.
Participate in multifunctional design teams and provide technical input to help achieve project goals.
Coordinate within the division to define project objectives, provide status updates, and prepare for release and deployment.
Provide engineering and business-process expertise on programs and issues.
Identify potential project complications and develop solutions.
Own the SSH product vision, strategy, roadmap, and business case across all business units.
Align system-level requirements among the Platform COE, CSS, business units (including HI), customers, and engineering teams.
Translate customer challenges and advanced-packaging trends into prioritized product and platform requirements.
Lead cross-functional roadmap planning and execution across hardware, software, automation, robotics, metrology, and subsystem teams.
Partner with PDC, Metrology organizations, external vendors, and leading-edge customers to identify future substrate-handling requirements and technology gaps.
Lead system integration of SSH capabilities across multiple product platforms.
Establish governance, prioritization, and program-management processes to drive execution across stakeholders.
Develop business growth strategies, market assessments, and value propositions to expand Applied Materials’ position in advanced packaging and AI-driven manufacturing.