Tech Proj/Prog Manager III S

Applied Materials • Santa Clara, CA

2d • $110,500 - $152,000 • Onsite

About The Position

Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the world’s technology.

Special Substrate Handling (SSH) is a strategic differentiator that enables semiconductor manufacturers to process increasingly complex non-standard substrates including warped wafers, glass carriers, stacked wafers, thick substrates, rectangular panels, and other advanced package structures that cannot be handled using conventional wafer automation systems. SSH combines specialized hardware, robotics, sensors, algorithms, and software controls to ensure reliable transport, alignment, and processing of these substrates while maintaining yield and productivity. This capability is becoming increasingly important as AI-driven demand accelerates the adoption of advanced packaging technologies such as CoWoS, chiplets, 2.5D/3D integration, panel-level packaging (e.g. CoPoS), and glass-core substrates. These next-generation architectures require larger, heavier, thinner, and more fragile substrates, creating significant handling challenges throughout the manufacturing flow. As a result, Special Substrate Handling is evolving from a niche engineering requirement into a critical enabler of AI and high-performance computing growth, unlocking new revenue opportunities, expanding platform applicability, improving customer time-to-market, and positioning Applied Materials to capture value across the rapidly growing advanced packaging ecosystem. The industry specs/standards around these special substrates are evolutionary and emerging, unlike the mature standards for silicon wafers. Enterprise materials indicate SSH requests have increased significantly over recent quarters, driven largely by advanced packaging and wafer-warp complexity, further reinforcing the strategic importance of this segment.

Own the SSH product vision, strategy, roadmap, and business case across all BUs. Drive alignment of system-level requirements between Platform COE, CSS, BU’s (incl. HI), customers, and engineering teams. Translate customer challenges and advanced packaging technology trends into prioritized product and platform requirements. Lead cross-functional roadmap planning and execution, ensuring alignment across hardware, software, automation, robotics, metrology, and subsystem teams. Partner with PDC, Metrology organizations, external vendors, and leading-edge customers to identify future substrate handling requirements and technology gaps. Act as the system integration leader for SSH capabilities across multiple product platforms. Establish governance, prioritization, and program management processes to drive execution across a broad stakeholder network. Develop business growth strategies, market assessments, and value propositions that expand Applied's position in advanced packaging and AI-driven manufacturing.

Requirements

• Demonstrates depth and/or breadth of expertise in own specialized discipline or field
• Interprets internal/external business challenges and recommends best practices to improve products, processes or services
• May lead functional teams or projects with moderate resource requirements, risk, and/or complexity
• Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgment and identify innovative solutions
• Impacts the achievement of customer, operational, project or service objectives; work is guided by functional policies
• Communicates difficult concepts and negotiates with others to adopt a different point of view
• Possess deep semiconductor equipment, automation, robotics, substrate handling, or system integration experience.
• Demonstrate the ability to operate simultaneously as a Product Manager, Systems Architect, and Program Manager.
• Have strong technical credibility with engineering teams while effectively influencing senior business leaders and customers.
• Understand advanced packaging technologies, AI/HPC market trends, and the manufacturing challenges associated with non-standard substrates.
• Excel at driving alignment across diverse organizations without direct authority.
• Be comfortable engaging directly with leading-edge customers and ecosystem partners to define future technology requirements.
• Demonstrate strong strategic thinking, business acumen, and execution discipline.
• Thrive in highly ambiguous environments where cross-functional leadership and systems thinking are critical for success.

Nice To Haves

• 10+ years in semiconductor equipment, advanced packaging, automation, systems engineering, product management, or platform development, with a proven track record leading complex cross-BU initiatives from concept through customer adoption.

Responsibilities

• Prepares project plans and drives the project from conception and planning to implementation. Will participate in the development of strategies, processes and resources.
• Manages project schedule and task details by utilizing project management tools such as reports, tracking charts, checklist and project scheduling software.
• Coordinates allocated resources from within the Division to achieve on-time and within budget performance objectives for the project. Initiates and manages purchase requisitions, and purchase orders.
• Drives cost schedule performance of equipment for internal and external customers and vendors worldwide.
• Participates on multifunctional design teams comprised of internal, external and/or matrixed headcount to complete projects. Provides technical input to team members to achieve project goals.
• Interfaces and coordinates within the division to define project objectives, provide status updates and prepare for release and deployment.
• Provides engineering and business process expertise to team and other members on various standard programs / issues.
• Identifies and resolves potential complications within the project and develops solutions for resolution.
• Own the SSH product vision, strategy, roadmap, and business case across all BUs.
• Drive alignment of system-level requirements between Platform COE, CSS, BU’s (incl. HI), customers, and engineering teams.
• Translate customer challenges and advanced packaging technology trends into prioritized product and platform requirements.
• Lead cross-functional roadmap planning and execution, ensuring alignment across hardware, software, automation, robotics, metrology, and subsystem teams.
• Partner with PDC, Metrology organizations, external vendors, and leading-edge customers to identify future substrate handling requirements and technology gaps.
• Act as the system integration leader for SSH capabilities across multiple product platforms.
• Establish governance, prioritization, and program management processes to drive execution across a broad stakeholder network.
• Develop business growth strategies, market assessments, and value propositions that expand Applied's position in advanced packaging and AI-driven manufacturing.

Benefits

• supportive work culture that encourages you to learn, develop, and grow your career
• comprehensive benefits package
• participation in a bonus and a stock award program

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: No Education Listed