The Technology Development (TD) Quality and Reliability organization enables deployment of next-generation semiconductor technologies through silicon-based quality, reliability, and technology readiness assessments. The Memory Quality and Reliability team works with Design, Device Engineering, Product Development Engineering, and Yield organizations to develop, characterize, and certify SRAM, Register File (RF), and Fuse technologies for advanced process nodes. It supports technology certification and PDK release milestones through memory characterization, silicon data analysis, predictive modeling, and risk assessment. The TD Memory Quality and Reliability Intern will collaborate with experienced engineers to evaluate advanced memory technologies and support technology readiness for future Intel Foundry process nodes. The role involves hands-on work in memory characterization, silicon data analytics, statistical modeling, and semiconductor technology development. The intern will analyze silicon data, develop predictive models, and assess memory performance across operating conditions to support technology certification decisions.
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Job Type
Full-time
Career Level
Intern
Education Level
Ph.D. or professional degree