Intel Corporation is the world's leading semiconductor company, driving innovation that powers the cloud, smart devices, and connected world around us. For over 50 years, Intel has been at the forefront of technological advancement, creating the building blocks for breakthrough innovations in artificial intelligence, 5G connectivity, and autonomous systems. Our Advanced Packaging Technology Development team is pioneering next-generation substrate and wafer assembly solutions that enable smaller, faster, and more efficient electronic devices that transform how we live and work. Join Intel's Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTDSWA) team as a Manufacturing Technician in Arizona. This role offers a unique opportunity to work with cutting-edge semiconductor packaging technologies while enjoying an innovative alternating work schedule that provides exceptional work-life balance. You'll be part of a mission-critical team responsible for developing and manufacturing the advanced packaging solutions that power tomorrow's technology, from smartphones and laptops to data centers and autonomous vehicles.
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Job Type
Full-time
Career Level
Entry Level
Education Level
High school or GED