Staff Thin Film Process Development Engineer

Micron Technology•Boise, ID

About The Position

Micron’s Technology Development organization develops materials and processes that enable future generations of memory technology. The team addresses complex thin-film, patterning, and process-integration challenges through materials science, semiconductor processing, experimental development, and multidisciplinary engineering. As a Staff Thin Film Process Development Engineer, you will develop and own advanced thin-film deposition processes for next-generation semiconductor technologies. You will translate integration and device requirements into film and process solutions, establish relationships between process conditions and material behavior, and independently lead complex development problems from root-cause investigation through experimental validation. The role combines deposition fundamentals, hands-on semiconductor engineering, and technical leadership.

Requirements

Bachelor’s degree or equivalent experience in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, Physics, or a related technical field.
More than 6 years of experience in the semiconductor industry.
Hands-on experience developing and owning semiconductor deposition techniques involving ALD, CVD, PECVD, PEALD, or similar thin-film methods.
Strong understanding of thin-film deposition fundamentals, surface and reaction mechanisms, material properties, and semiconductor process integration.
Ability to independently take a complex process-development problem from root-cause investigation through DOE, experimental validation, data analysis, and technical recommendation.
Experience collaborating across semiconductor process modules and technical teams to resolve process, defectivity, integration, yield, or reliability challenges.

Nice To Haves

Experience developing dielectric, hard-mask, spacer, insulating, etch-selective, or electrically functional thin films for advanced semiconductor applications.
Experience integrating new materials or deposition processes into advanced semiconductor process flows or test structures.
Hands-on experience with characterization techniques such as XPS, AFM, XRD, AES, ellipsometry, TEM/SEM, EBSD, SIMS, or related methods.
Experience correlating material and process behavior with patterning, defectivity, electrical performance, yield, or reliability.
Experience using AI-assisted analytics to enhance data interpretation, anomaly detection, process optimization, or yield-improvement activities.

Responsibilities

Develop, optimize, and own advanced thin-film deposition processes using CVD, PECVD, ALD, PEALD, or related technologies.
Translate device, patterning, and integration requirements into measurable film properties, process specifications, and manufacturable deposition solutions.
Design and implement experiments and DOEs to identify process mechanisms, variation sources, defectivity, and interactions among incoming materials, substrates, deposition conditions, and downstream processing.
Establish relationships between process conditions, film properties, patterning and integration behavior, electrical performance, yield, and reliability.
Drive thin-film concepts from feasibility through integration and demonstration in relevant semiconductor test structures and process flows.
Partner with patterning, etch, metrology, process integration, equipment, device, and supplier teams to solve complex cross-module engineering problems.
Evaluate new deposition technologies, materials, precursors, and process capabilities using data-driven and physics-based decision-making.
Provide technical leadership by defining development direction, communicating technical recommendations, and mentoring engineers across multidisciplinary teams.