Principal Thin Films Process Development Engineer

Micron • Albany, NY

1d

About The Position

As part of Micron's Technology Development (R&D) organization, the Principal Thin Films Process Development Engineer will support Micron's collaboration with NY CREATES in Albany, New York. The role develops innovative thin-film and materials solutions for future memory technologies, applying deep technical expertise to semiconductor integration challenges and advancing new concepts toward manufacturable technology.

The position focuses on developing solutions for advanced DRAM architectures, patterning, and emerging integration schemes. It translates device and integration requirements into film properties and manufacturable processes, and advances materials and processes from technical feasibility through semiconductor integration and demonstration on relevant test vehicles. The engineer provides technical leadership across multidisciplinary teams and mentors other engineers.

Requirements

• PhD, MS, or equivalent experience in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, Physics, or a related technical field.
• At least 3 years of relevant semiconductor industry experience.
• Demonstrated industry experience in thin-film materials and/or process development for semiconductor applications.
• Experience applying thin-film, materials, surface science, deposition, or process-integration fundamentals to semiconductor development challenges.
• Experience designing and analyzing experiments using DOE and data-driven methods to develop or optimize materials and processes.
• Proven ability to independently drive complex technical work and communicate recommendations across multidisciplinary teams.

Nice To Haves

• Experience with CVD, PECVD, ALD, PEALD, plasma-enhanced deposition, and/or other advanced thin-film technologies.
• Experience developing or integrating thin films for memory, logic, HPC/CMOS, or other semiconductor technologies.
• Experience with EUV or patterning-enabling films such as hard masks, underlayers, spacer materials, or etch-selective films.
• Experience using thin-film or surface characterization techniques such as XPS, AFM, XRD, ellipsometry, TEM/SEM, or SIMS to guide process development and integration.
• Demonstrated technical innovation through new material or process introduction, advanced process development, patents, or publications.

Responsibilities

• Develop innovative thin-film and materials solutions for advanced DRAM architectures, patterning, and emerging integration schemes.
• Translate semiconductor device and integration requirements into film properties and manufacturable process solutions.
• Build, optimize, and characterize advanced thin-film deposition processes.
• Advance new materials and processes from technical feasibility through semiconductor integration and demonstration on relevant test vehicles.
• Design and implement rigorous experiments and DOEs; use data-driven and AI-enabled methods to analyze results, optimize processes, and resolve material, defectivity, yield, and reliability challenges.
• Partner with process integration, patterning, etch, metrology, equipment, device, and supplier teams to evaluate new materials and process capabilities.
• Define development strategy, influence decisions, present recommendations, and mentor engineers across multidisciplinary teams.

Benefits

• Choice of medical, dental, and vision plans.
• Programs that help protect income if unable to work due to illness or injury.
• Paid family leave.
• Paid time off.
• Paid holidays.
• Additional compensation may include bonuses and equity.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal