Thin Films Module Development Engineer

Intel Corporation•Hillsboro, OR

6d•$155,520 - $255,200•Onsite

About The Position

Intel Foundry is seeking experienced Thin Films Metals Module Development Engineers for its Technology Development organization. The role develops and delivers metals modules for advanced semiconductor technologies, combining in-depth hardware knowledge and process expertise to meet program process needs within hardware capabilities. This is a hands-on technical role for results-oriented engineers who can formulate concise technical problem statements, establish roadmaps and timelines, lead with data, and partner with stakeholders to deliver results on time.

Requirements

Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related STEM field with 6+ years of experience; or a master's degree in one of these fields with 4+ years of experience; or a Ph.D. in one of these fields with 2+ years of experience.
Experience in semiconductor manufacturing or process development, including one or more of the following: process optimization, defect reduction, and manufacturing process improvements for advanced technology nodes; proficiency in Design of Experiments (DOE), Statistical Process Control (SPC), and structured problem-solving methodologies; hands-on expertise in dry etch processes, material science, and equipment metrology; or technical experience with semiconductor manufacturing equipment and collaboration with suppliers to optimize hardware and materials.

Nice To Haves

Doctoral degree in a relevant engineering or science field.
Experience with sub-10nm technology nodes and advanced device architectures such as FinFET or Gate-All-Around (GAA).
Proven record of delivering process solutions in Technology Development (TD) and High Volume Manufacturing (HVM).
Cross-functional leadership experience for yield improvement, defect reduction, or technology ramp initiatives.
Experience mentoring engineers and providing technical guidance.
Strong ownership mindset and ability to lead initiatives from concept through implementation.

Responsibilities

Develop and deliver metals modules for advanced semiconductor technologies.
Develop modules that fulfill program process needs within hardware capabilities.
Formulate concise technical problem statements and establish roadmaps and timelines.
Lead with data and partner with stakeholders to deliver results on time.