Principal Thin Films Process Development Engineer

Micron Technology•Albany, NY

2d•$111,000 - $190,000

About The Position

As part of Micron Technology’s Technology Development (R&D) organization, this role develops innovative thin-film and materials solutions for future memory technologies in collaboration with NY CREATES in Albany, New York. The engineer applies deep technical expertise to address semiconductor integration challenges and advance new concepts toward manufacturable technology. The position focuses on developing thin-film and materials solutions for advanced DRAM architectures, patterning, and emerging integration schemes. It translates device and integration requirements into film properties and manufacturable processes, and advances materials and processes from technical feasibility through semiconductor integration and demonstration on relevant test vehicles. The role also provides technical leadership, influences development decisions, communicates recommendations, and mentors engineers across multidisciplinary teams.

Requirements

PhD, MS, or equivalent experience in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, Physics, or a related technical field.
At least 3 years of relevant semiconductor industry experience.
Industry experience in thin-film materials and/or process development for semiconductor applications.
Experience applying thin-film, materials, surface science, deposition, or process-integration fundamentals to semiconductor development challenges.
Experience designing and analyzing experiments using DOE and data-driven methods to develop or optimize materials and processes.
Ability to independently drive complex technical work and communicate recommendations across multidisciplinary teams.

Nice To Haves

Experience with CVD, PECVD, ALD, PEALD, plasma-enhanced deposition, or other advanced thin-film technologies.
Experience developing or integrating thin films for memory, logic, HPC/CMOS, or other semiconductor technologies.
Experience with EUV or patterning-enabling films, such as hard masks, underlayers, spacer materials, or etch-selective films.
Experience using thin-film or surface characterization techniques such as XPS, AFM, XRD, ellipsometry, TEM/SEM, or SIMS to guide process development and integration.
Demonstrated technical innovation through new material or process introduction, advanced process development, patents, or publications.

Responsibilities

Develop thin-film and materials solutions for advanced DRAM architectures, patterning, and emerging integration schemes.
Translate semiconductor device and integration requirements into film properties and manufacturable process solutions.
Build, optimize, and characterize advanced thin-film deposition processes.
Advance new materials and processes from technical feasibility through semiconductor integration and demonstration on relevant test vehicles.
Design and implement experiments and DOEs; use data-driven and AI-enabled methods to analyze results, optimize processes, and address material, defectivity, yield, and reliability challenges.
Partner with process integration, patterning, etch, metrology, equipment, device, and supplier teams to evaluate materials and process capabilities.
Define development strategy, influence technical decisions, present recommendations, and mentor engineers across multidisciplinary teams.