About The Position

Micron Technology is seeking a highly motivated HBM Design Development Technical Leadership (DDTL) Engineer. The role sits at the intersection of semiconductor engineering, technical program execution, data analytics, automation, and AI-enabled productivity. The engineer will support next-generation HBM programs by tracking execution, identifying risks and cross-functional dependencies, driving actions to closure, and providing clear program visibility. A key expectation is the ability and willingness to rapidly and independently adopt AI-enabled tools to improve analysis, communication, quality, and overall engineering efficiency. The position supports HBM program execution from design planning through design release and silicon validation. It involves maintaining program roadmaps, dashboards, risk registers, and execution metrics, and preparing meeting takeaways, leadership updates, decision summaries, and milestone-readiness materials. The engineer works across design and product-development teams to identify execution gaps and drive follow-up.

Requirements

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field.
  • 5+ years of relevant experience in semiconductor, ASIC, SoC, memory, hardware development, or technical engineering program execution.
  • Experience with engineering schedules, roadmap management, risk tracking, or technical program execution.
  • Experience with Python automation, dashboards, Power BI, data visualization, or workflow automation.
  • Demonstrated willingness and ability to independently leverage AI-enabled tools to improve individual and team productivity.

Nice To Haves

  • Hands-on experience applying AI to technical analysis, data synthesis, communication, automation, or engineering productivity.
  • Knowledge of DRAM, DDR, LPDDR, GDDR, HBM, ASIC, or SoC development.
  • Exposure to RTL, verification, physical design, STA, power, DFT, layout, CAD, silicon validation, or product engineering.
  • Familiarity with semiconductor design milestones, tapeout, and silicon-development workflows.
  • Basic understanding of semiconductor design and product-development processes.
  • Programming or scripting experience with Python, Tcl, Perl, C/C++, or similar languages.

Responsibilities

  • Support HBM program execution from design planning through design release and silicon validation.
  • Independently leverage AI for meeting synthesis, technical-data analysis, roadmap and schedule analysis, communication, and workflow automation.
  • Develop AI-assisted workflows and automation to reduce manual effort and continuously improve DDTL and engineering productivity.
  • Track schedules, milestones, technical dependencies, risks, issues, and action items across assigned programs.
  • Work across Design, Verification, Physical Design, CAD, DFT, Product Engineering, and Architecture teams to identify execution gaps and drive follow-up.
  • Develop sufficient technical understanding to recognize inconsistencies, identify downstream impacts, and ask effective questions.
  • Maintain program roadmaps, dashboards, risk registers, and execution metrics.
  • Prepare crisp meeting takeaways, leadership updates, decision summaries, and milestone-readiness materials.

Benefits

  • Choice of medical, dental, and vision plans.
  • Programs to help protect income in the event of illness or injury.
  • Paid family leave.
  • Paid time off.
  • Paid holidays.
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