Sr. Process Development Engineer

Skywater•Kissimmee, FL

About The Position

The Sr. Process Development Engineer will lead, develop, and improve an integrated Advanced Packaging process flow at the Florida Advanced Packaging site. The role focuses on new process development, transfer, and integration in a manufacturing environment, including developing or integrating manufacturable process recipes for foundry customers in areas such as metal deposition, dielectric deposition, photo, etch, or CMP. It also involves process integration for MEMS and photonic devices in advanced-packaging backend-of-line processes. The engineer will characterize process conditions using metrology tools, document results, investigate and drive integration changes to improve device performance and yield, and work with process and tool engineers to identify and address process marginalities. The role includes monitoring in-line and end-of-line SPC charts for trends or excursions and monitoring and improving electrical test parametrics. It may develop into a project-management position integrating customer device requests. Other duties may be assigned. The position requires strong oral and written communication skills for working with foundry customers, colleagues, and management.

Requirements

BS in Engineering with 2–4 years of experience, or an MS/PhD with 0–2 years of experience.
Knowledge of or experience with fab processing tools.
MEMS/photonic device and integration knowledge supported by a relevant combination of experience and/or an advanced degree.
Knowledge of DOE, SPC, and 6-sigma concepts and applications.
Clear problem-solving capability; data-driven, inventive, and solution-oriented approach; ability to articulate thought processes.
Ability to work independently and in cross-functional teams.
Strong oral and written communication skills.
U.S. citizenship; the position requires holding or being able to obtain a government security clearance.

Nice To Haves

Project management skills and/or defined project-management training.

Responsibilities

Lead, develop, and improve an integrated Advanced Packaging process flow.
Develop or integrate robust, manufacturable process recipes for foundry customers in one or more of metal deposition, dielectric deposition, photo, etch, or CMP.
Perform process integration for MEMS and photonic devices in advanced-packaging backend-of-line processes.
Use metrology tools to characterize process conditions and document results.
Investigate and drive integration changes to improve device performance and yield.
Work with process and tool engineers to identify process marginalities and make improvements.
Monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed through integration changes.
Monitor and improve electrical test parametrics.
Potentially develop into a project-management position integrating customer device requests.
Perform other duties as assigned.