Sr. Photolithography Process Development Engineer

SkyWater Technology Foundry, Inc.•Kissimmee, FL

1d•$79,440 - $119,160

About The Position

SkyWater is seeking an experienced Lithography Engineer to support its Florida Advanced Packaging site. The position develops, optimizes, integrates, transfers, and continuously improves lithography processes for advanced semiconductor packaging and MEMS/photonic device manufacturing. The engineer works with process and equipment engineers, integration teams, and foundry customers to create manufacturable processes that meet critical-dimension, overlay, defectivity, and patterning requirements. The role uses data-driven methods to improve process capability, yield, and device performance, and requires effective communication of technical concepts, results, and recommendations to customers, colleagues, and management. The position includes developing photoresist and patterning processes; optimizing coating, baking, exposure, development, descum, and related steps; integrating lithography with other fab processes; characterizing performance with metrology and inspection tools; analyzing data and SPC; troubleshooting defects and yield losses; and supporting new products, customer-specific development, and technology transfers. The engineer also develops process specifications, recipes, control strategies, reports, and documentation, and participates in cross-functional improvement projects. The position requires U.S. citizenship because the employee must hold or be able to obtain a government security clearance. The annual salary range is $79,440–$119,160. SkyWater offers incentive-plan participation and employee financial benefits, including a 401(k) match and life insurance, along with a comprehensive benefits package.

Requirements

Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Physics, or a related engineering or scientific discipline, with 1–2+ years of experience.
Hands-on semiconductor fab processing experience and a strong understanding of lithography processes and equipment.
Experience with conventional photolithography, including resist coating, soft bake, exposure, post-exposure bake, development, and resist strip.
Experience with varied lithography platforms and exposure technologies, including mask-based, direct-write, and maskless lithography.
Understanding of critical dimension, overlay, focus, dose, resist thickness, pattern fidelity, resolution, defectivity, and process window.
Experience developing and optimizing lithography processes for complex patterning requirements, including high-aspect-ratio structures, fine features, large-area patterns, and customized customer designs.
Experience with semiconductor patterning and integration, including interactions with etch, deposition, CMP, metallization, and dielectric processes.
Experience with CD-SEM, optical microscopy, profilometry, overlay metrology, defect inspection, and other lithography characterization techniques.
Knowledge of DOE, SPC, Six Sigma, statistical analysis, and process capability concepts and applications.
Experience using data analysis and statistical techniques to identify trends, root causes, process marginalities, and improvement opportunities.
Strong understanding of semiconductor manufacturing, process control, and yield-improvement methods.
Clear problem-solving capability and a data-driven, inventive, and solution-oriented approach.
Ability to explain technical thought processes and communicate complex engineering concepts effectively.
Ability to work independently and contribute effectively to cross-functional teams.
Strong written and verbal communication skills.
U.S. citizenship and the ability to hold or obtain a government security clearance.

Nice To Haves

Master’s or Ph.D. degree; the posting indicates 0–1 years of experience for this education path.

Responsibilities

Develop, optimize, transfer, and integrate lithography processes in high-volume or advanced semiconductor manufacturing.
Develop and qualify manufacturable photoresist and patterning processes for advanced packaging, MEMS, and photonic device applications.
Optimize resist coating, baking, exposure, development, descum, and associated process steps.
Develop and optimize exposure recipes to meet critical-dimension, pattern-fidelity, overlay, and process-margin requirements.
Support lithography integration with deposition, etch, CMP, metallization, and dielectric processes.
Develop and maintain lithography process specifications, operating windows, recipes, and documentation.
Evaluate lithography performance using CD-SEM, optical metrology, profilometry, overlay metrology, defect inspection, and other characterization techniques.
Conduct Design of Experiments (DOE) to identify key process parameters and establish robust operating windows.
Analyze process data to identify variation, process marginalities, and continuous-improvement opportunities.
Monitor inline and end-of-line SPC charts for trends, excursions, and abnormal process behavior.
Investigate lithography-related defects, patterning failures, CD variation, overlay errors, and yield losses using structured problem-solving methods.
Work with equipment and process engineers to troubleshoot lithography tool performance and improve equipment and process capability.
Support new product introduction, customer-specific process development, and technology transfers into manufacturing.
Collaborate with integration and device teams to translate device designs and lithography requirements into manufacturable solutions.
Monitor electrical test parametrics and correlate lithography performance with downstream device and package performance.
Develop process-control strategies and recommend metrology and monitoring plans.
Prepare technical reports, presentations, process documentation, and development summaries for customers, colleagues, and management.
Participate in cross-functional problem-solving teams and lead lithography-related improvement projects.