Sr. Photolithography Process Development Engineer

Skywater•Kissimmee, FL

11d

About The Position

The Sr. Photolithography Process Development Engineer supports the Florida Advanced Packaging site by developing, optimizing, integrating, and continuously improving lithography processes for advanced semiconductor packaging and MEMS/photonic device manufacturing. The role works with process and equipment engineers, integration teams, and foundry customers to create robust, manufacturable processes that meet critical-dimension, overlay, defectivity, and patterning requirements. It uses data-driven methods to improve process capability, yield, and device performance, and requires clear communication of technical concepts, development results, and recommendations to customers, colleagues, and management. The engineer develops and qualifies photoresist and patterning processes; optimizes coating, baking, exposure, development, descum, and related process steps; and integrates lithography with deposition, etch, CMP, metallization, and dielectric processes. The role uses metrology and inspection data, DOE, SPC, and structured problem-solving to establish process windows, investigate variation and defects, and improve manufacturing capability. It also supports product introduction, customer-specific process development, technology transfer, and cross-functional improvement projects.

Requirements

Bachelor’s degree in Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Physics, or a related engineering or scientific discipline, with 1–2+ years of experience; alternatively, an MS or PhD with 0–1 years of experience is listed as preferred.
Hands-on semiconductor fab processing experience and a strong understanding of lithography processes and equipment.
Experience with conventional photolithography, including resist coating, soft bake, exposure, post-exposure bake, development, and resist strip.
Experience with multiple lithography platforms and exposure technologies, including mask-based, direct-write, and maskless lithography.
Understanding of lithography parameters including critical dimension, overlay, focus, dose, resist thickness, pattern fidelity, resolution, defectivity, and process window.
Experience developing and optimizing lithography for complex patterning requirements, including high-aspect-ratio structures, fine features, large-area patterns, and customized customer designs.
Experience with semiconductor patterning and integration, including lithography interactions with etch, deposition, CMP, metallization, and dielectric processes.
Experience with CD-SEM, optical microscopy, profilometry, overlay metrology, defect inspection, and other lithography characterization techniques.
Knowledge of DOE, SPC, Six Sigma, statistical analysis, and process capability concepts and applications.
Experience applying data analysis and statistical techniques to identify process trends, root causes, process marginalities, and improvement opportunities.
Strong understanding of semiconductor manufacturing, process control, and yield-improvement methodologies.
Clear, data-driven, inventive, and solution-oriented problem-solving capability.
Ability to articulate technical thought processes and communicate complex engineering concepts effectively.
Ability to work independently and contribute effectively within cross-functional teams.
Strong written and verbal communication skills.
Must hold or be able to obtain a government security clearance; U.S. citizenship is required.

Nice To Haves

MS or PhD in Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Physics, or a related engineering or scientific discipline.

Responsibilities

Develop, optimize, transfer, and integrate lithography processes in high-volume or advanced semiconductor manufacturing.
Develop and qualify manufacturable photoresist and patterning processes for advanced packaging, MEMS, and photonic devices.
Optimize resist coating, baking, exposure, development, descum, and associated process steps.
Develop and optimize exposure recipes to meet critical-dimension, pattern-fidelity, overlay, and process-margin requirements.
Support integration of lithography with deposition, etch, CMP, metallization, and dielectric processes.
Develop and maintain lithography process specifications, operating windows, recipes, and documentation.
Use CD-SEM, optical metrology, profilometry, overlay metrology, defect inspection, and other characterization methods to evaluate lithography performance.
Conduct Design of Experiments to identify key process parameters and establish robust operating windows.
Analyze process data for sources of variation, process marginalities, and continuous-improvement opportunities.
Monitor inline and end-of-line SPC charts for trends, excursions, and abnormal process behavior.
Investigate lithography-related defects, patterning failures, CD variation, overlay errors, and yield losses using structured problem-solving methods.
Partner with equipment and process engineers to troubleshoot lithography tool performance and improve equipment and process capability.
Support new product introduction, customer-specific process development, and technology transfers into manufacturing.
Collaborate with integration and device teams to translate device designs and lithography requirements into manufacturable process solutions.
Monitor electrical test parametrics and correlate lithography performance with downstream device and package performance.
Develop process-control strategies and recommend metrology and monitoring plans for lithography processes.
Prepare technical reports, presentations, process documentation, and development summaries for customers, colleagues, and management.
Participate in cross-functional problem-solving teams and lead lithography-related improvement projects.