About The Position

Starlink is seeking a Sr. IC Packaging Test Engineer with expertise in semiconductor packaging and wafer test to join their team. This role involves bringing integrated circuit packaging and assembly in-house for development and manufacturing. The engineer will work closely with test equipment manufacturers and chip/system designers to develop and release production test solutions, taking full ownership of packaged component and wafer test. The goal is to make Starlink more affordable by optimizing these processes.

Requirements

  • Bachelor’s degree in electrical engineering, computer engineering, computer science, physics, or other applied engineering discipline
  • 5+ years of programming experience in C/C++/Visual/Python

Nice To Haves

  • 10+ years industry experience with microelectronics packaging development
  • Advanced technical degree
  • Expertise in developing digital, high-speed and RF semiconductor test programs for production
  • Strong RF test knowledge
  • Experience with digital, high speed SERDES, RF, and mixed signal testing
  • Wafer sort, wafer probe, probe card design and test experience
  • Custom socket and wafer prober design and test experience
  • Semiconductor functional and parametric test design and development
  • Digital waveform and test plan programming development

Responsibilities

  • Own electrical test equipment definition for packaging and wafer level production testing
  • Bring-up of test equipment and test programs for mass manufacturing
  • Create automated test equipment (ATE) test programs and test plans
  • Define full and comprehensive testing requirements to ensure product conformance
  • Schematic and electrical review for all test equipment
  • Supplier test interface for implementing new features, cost, and productivity improvements
  • Implement advanced testing solutions for SpaceX next generation products
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