IC Packaging Engineer - WLP

Apple

1d

About The Position

Join our WLP team and help develop next-generation Wafer Level Packaging and 2.5D / 3D solutions. You'll start by supporting package concept exploration, selection and configuration studies, and prototype evaluations, while contributing to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product. You'll partner with design, test, reliability, and product teams as well as foundry and OSAT partners, and grow over time into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis. We're looking for a curious, detail-oriented engineer with strong fundamentals, a passion for precision, and the drive to learn quickly and solve hard problems.

Requirements

• Minimum requirement of a bachelors degree

Nice To Haves

• MS or PhD in a relevant discipline, with a thesis or coursework in semiconductor packaging, materials, thermal, mechanical, or electrical modeling
• Internship or research experience with a semiconductor company, OSAT, foundry, or academic packaging/materials lab.
• Familiarity with one or more of: Wafer Level Packaging, 2.5D / 3D packaging, memory packaging, assembly processes, IC packaging materials, or reliability standards.
• Exposure to materials characterization tools (SEM, EDX, CSAM, FTIR, DMA, TMA, etc.) or FA techniques, ideally on wafer level
• General understanding of wafer level packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
• Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
• Ability to work independently and orchestrate projects with cross functional teams
• Solution-oriented mindset with strong fundamentals in engineering physics
• Good program management skills.

Responsibilities

• Contribute to package concept exploration, support package selection and configuration studies.
• Grow into ownership of package integration across SoC and advanced packaging projects.
• Support package concept exploration, selection and configuration studies, and prototype evaluations.
• Contribute to process development efforts that mature packaging solutions toward mass-production (MP) readiness on product.
• Partner with design, test, reliability, and product teams as well as foundry and OSAT partners.
• Grow into end-to-end ownership of well-scoped deliverables across characterization, modeling, and failure analysis.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level