IC Packaging Design & Layout Engineer

Draper•Cambridge, MA

3d•$82,300 - $220,000•Onsite

About The Position

The IC Packaging Design & Layout Engineer is responsible for the end to end creation of advanced integrated circuit (IC) packaging solutions that meet performance, power, size, and reliability targets for Draper’s next generation hardware platforms. The role requires deep technical expertise in package architecture, high speed layout, signal integrity analysis, and design for manufacturability (DFM). The engineer will collaborate with cross functional teams—including silicon design, thermal/mechanical analysts, and manufacturing—to deliver manufacturable package designs that enable Draper’s strategic product roadmap.

Requirements

Proficiency with high density substrate and packaging layout tools. Experience with Siemens Xpedition is desirable.
Solid understanding of high-speed design signal integrity best practices.
Experience with SI/PI analysis using Ansys SIwave and HFSS, Hyperlynx, or other industry standard tools.
Proficiency in electronic design.
Ability to write detailed design specifications.
Excellent verbal and written communication skills.
Excellent organizational skills and attention to detail.
Excellent time management skills with the proven ability to meet deadlines.
Strong analytical and problem-solving skills.
Ability to prioritize tasks.
Thorough understanding of engineering theories and procedures.
5-10 years experience in electrical engineering or related field.
Applicants selected for this position will be required to obtain and maintain a US government security clearance.

Nice To Haves

Advanced degree preferred.

Responsibilities

Lead concept development for advanced packages (e.g., fan out wafer level, 2.5 D/3 D interposer, system in package).
Produce detailed layout for substrates, interposers, and die to die routing using Siemens Xpedition.
Own package-level SI/PI strategy, including high speed digital interfaces, power delivery network (PDN) design, and decoupling strategy.
Perform SPICE, EM, and S parameter simulations to validate SI, PDN, and crosstalk.
Partner with mechanical engineers and analysts on die attach, under fill, molding, and thermal interface materials.
Partner with silicon, RF, and board design engineers to co-optimize die floorplans and package interfaces.
Serve as the primary technical interface to substrate vendors, assembly houses, and OSATs.
Author complete package build documentation, specifications, and test plans.
Drive solutions to complex problems with limited direction – contribute to requirements development, propose paths forward, and adapt appropriately to changes in requirements.
Translates project and system requirements into well-defined hardware architectures working with cross-functional teams.
Innovatively solves issues, drives completion of the project to schedule, and collaboratively works with other technical contributors.
Builds, debugs, and tests prototypes and deliverable hardware.
Prepares documentation for manufacturing, and provides continuous support.
Researches and enables innovative solutions for cutting-edge designs.
Engages other engineers and partners to develop reliable, cost effective end solutions for products.
Independently performs complex electronic architectures and designs.
Able to manage a task with multiple cross functional members and effectively communicates status to project leadership and customers.
Actively mentors less experienced teammates and provides thoughtful, constructive feedback.
Support business development and proposal activities.