Sr. IC Package Design Engineer (Silicon Engineering)

SpaceX • Austin, TX

13h

About The Position

SpaceX is seeking a motivated, proactive, and intellectually curious engineer to work alongside world-class cross-disciplinary teams. In this role, you will be developing cutting-edge next-generation ASICs for deployment in space and ground infrastructures. As an IC Package Design Engineer, you will be an integral part of the IC design team and lead packaging for custom in-house ASICs and RFICs for digital beam formers and modems.

Requirements

• Bachelor's degree in electrical engineering, computer engineering, or physics
• 5+ years of experience with IC package design

Nice To Haves

• Experience with Co-packaged Optics (CPO)
• Thorough understanding of signal and power integrity fundamentals
• Substrate design experience for RF, digital, high-speed and mixed signal die
• Experience with Cadence APD+/SIP or similar design tools
• Experience in package design electrical review, SI/PI analysis
• Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, ADS
• Experience in package design for manufacturing reviews
• Familiar with BGA package substrate technologies
• Strong problem solving skills with strong engineering fundamentals

Responsibilities

• Own and drive advanced package selection, new product BGA configuration and package structure
• Responsible for package/SIP layout, optimization, design verification and tapeout
• Interface and coordinate with cross-functional groups throughout SpaceX on new product package selection, feasibility analysis and design
• Work cross-functionally, understand trade-offs, constraints, and optimizing silicon floor plan, bump and package pin out
• Simulate and optimize signal/power integrity and RF performance of the package design
• Drive methodology, innovations, and productivity improvements in package design

What This Job Offers

• Job Type: Full-time
• Career Level: Senior