Sr. Engineer, Package Design

Sitime Corporation•Santa Clara, CA

20h

About The Position

SiTime is the Precision Timing company. Timing is the heartbeat of all electronics, ensuring performance, resilience and scalability. For decades, quartz devices, non-silicon technology, have kept systems in sync, but they struggle in harsher, more demanding environments. MEMS-based Precision Timing delivers greater accuracy, smaller size and resilience. Today, MEMS timing powers over 400 applications, including high-growth ones in AI datacenters, automated driving, industrial and humanoid robots, wearables and IoT. Our semiconductor MEMS programmable solutions offer a rich feature set that enables customers to differentiate their products with higher performance, smaller size, lower power, and better reliability. With more than 4 billion devices shipped, SiTime is changing the timing industry. For more information, visit: www.sitime.com . The Senior Semiconductor Package Engineer is responsible for the specification, design, development, and qualification of unique custom packaging technology for SiTime’s revolutionary MEMS-based timing products. Packaging technologies include QFN, WLCSP, ceramic, substrate-based, and multi-chip/package modules, all of which incorporate custom-designed MEMS and CMOS components.

Requirements

M.S or PhD. Degree in Mechanical Engineering, Material Science, or other relevant field
5+ years’ experience in semiconductor IC packaging technology and methodology
Experience managing overseas OSATs to bring products into production
Knowledge of leadframe-based, flip-chip, and substrate-based packages
Experience with flip-chip and bumping technologies
Understanding of thermal, stress, and electrical considerations in package design
Hands-on experience with CAD software (AutoCAD preferred but not required)
The desire to work in a fast-paced, challenging, and risk-taking environment

Nice To Haves

Understanding of thermal, mechanical, and electrical modeling for semiconductor packages
Understanding of material characterization techniques (DMA, TMA, TGA, etc.)

Responsibilities

Develop new packaging technology for SiTime’s MEMS-based timing solutions
Lead activities for package design, development, and release-to-production
Develop, manage, and analyze DoEs running locally and overseas
Manage development activities at OSATs
Work with OSATs to prototype and test new custom package designs
Ensure new technologies achieve required performance, reliability, and quality requirements
Lead troubleshooting activities related to package design or performance