Senior Package Design Engineer

Micron Technology • Boise, ID

5d

About The Position

Micron Technology, Inc. is a global leader in memory and storage solutions, delivering innovative technology from silicon to systems! The design engineering team develops advanced memory products by combining circuit design, package development, and system-level validation. The team works collaboratively across functions to deliver high-quality, reliable, and cost-effective solutions. As a Senior Package Design Engineer, you will design, develop, and optimize advanced semiconductor packages for memory and logic products. You will work with global, cross-functional teams to deliver scalable, high-performance solutions that meet product, manufacturing, and customer requirements.

Requirements

• Bachelor’s degree in Electrical Engineering, Materials Science, or a related field, or equivalent practical experience.
• 5+ years of experience in semiconductor package design, circuit design, or a related area.
• Experience with package layout tools and design processes, including floorplanning and routing.
• Understanding of electrical, thermal, and mechanical behavior in semiconductor packaging.
• Experience working with multi-functional or global engineering teams.

Nice To Haves

• Master’s degree
• Experience with memory technologies such as DRAM or NAND.
• Experience using simulation tools for signal integrity, power integrity, or thermal analysis.
• Familiarity with semiconductor manufacturing and OSAT partners.
• Experience leading projects or influencing technical decisions across teams.

Responsibilities

• Define and optimize package architectures for memory, logic, and analog products.
• Perform parasitic modeling, validation, and design updates to improve performance and reliability.
• Lead package layout activities, including floorplanning, placement, and routing for high-density designs.
• Partner with simulation teams to validate electrical, thermal, and mechanical performance.
• Collaborate with engineering, manufacturing, and product teams to support design for manufacturability.
• Work with internal teams and external partners to address design, assembly, and production challenges.
• Contribute to design standards, tools, and guidelines to improve team efficiency and quality.
• Support development of next-generation packaging solutions for future memory technologies.

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior