Package Design Engineer
About The Position
In this role, you will be at the intersection of silicon design and system implementation. You will play a critical part in designing and delivering next-generation, high-performance packaging solutions; including 2.5D/3D, chiplet-based, FCBGA, SiP, WLCSP, wire bond, and QFP/QFN packages that power our industry-leading automotive SoCs, industrial IoT microcontrollers, and AI-forward computing platforms. This role demands strong technical depth in package layout execution, a deep understanding of manufacturability, and a collaborative mindset for cross-domain co-design with our global silicon, SI/PI, thermal, and reliability teams.
Requirements
- 4+ years of hands-on experience in Package CAD layout and development.
- Strong background in 2.5D / 3D IC packaging, FCBGA, advanced substrate-based packages, and multi-die/chiplet-based designs.
- High proficiency in industry-standard tools such as Cadence Allegro Package Designer (APD / SiP), Siemens Xpedition / Substrate Integrator, or equivalent.
- Proven experience working with advanced manufacturing design rules and interfacing directly with Tier-1 OSATs and foundries.
- Solid basic understanding of Signal Integrity (SI) and Power Integrity (PI) fundamentals, high-speed routing, impedance control, and crosstalk mitigation.
- Strong communication, presentation, and documentation skills with a proven track record of working effectively in global, cross-functional team environments.
Responsibilities
- Execute package layout design and development for advanced packages, including 2.5D/3D IC, FCBGA, SiP, WLCSP, and multi-chip modules.
- Develop and maintain package CAD databases, ensuring strict accuracy and adherence to design guidelines, DFM (Design for Manufacturing), and DFA (Design for Assembly) to guarantee high manufacturability and high-yield reliability.
- Manage the complete design cycle: from schematic creation, netlist import, and footprint assignment to generating manufacturing outputs (Gerbers, drill data, and fabrication/assembly drawings).
- Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures.
- Collaborate closely with SI/PI, thermal, reliability, and DFT teams to support co-optimization and participate in critical design reviews.
- Ensure all designs strictly comply with foundry, OSAT, and manufacturing design rules (DRC, LVS).
- Support Engineering Change Orders (ECO) cycles, design updates, and version control throughout the project lifecycle.
Benefits
- Flexible and inclusive work environment
- Remote work option
- Employee Resource Groups
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
