Sr. Advanced Semiconductor Packaging Engineer - 980

QuantinuumBrooklyn Park, MN
$115,000 - $135,000Onsite

About The Position

We are seeking an experienced semiconductor packaging engineer to develop innovative and reliable packaging schemes for the highly scaled ion traps in our quantum computers. The ideal candidate will be a mid-career engineer with a background in advanced packaging concepts. This role will work alongside ASIC designers, ion trap designers and fabricators, optical designers, and third-party vendors to prototype, design, and fabricate ion trap assemblies for our quantum computers. Candidates should expect to be immersed in a fast-paced, multi-functional, team-based, challenging technical environment where an individual with talent and initiative can stand out and thrive. All applicants for placement in safety-sensitive positions will be required to submit to a pre-employment drug test.

Requirements

  • Bachelor’s degree minimum
  • 5+ years of experience in an engineering or R&D environment
  • 3+ years of experience in advanced semiconductor packaging development
  • Due to Contractual requirements, must be a U.S. Person defined as, U.S. citizen permanent resident or green card holder, workers granted asylum or refugee status.
  • Due to national security requirements imposed by the U.S. Government, candidates for this position must not be a People's Republic of China national or Russian national unless the candidate is also a U.S. citizen.

Nice To Haves

  • PhD in Physics or Engineering
  • 7 years of experience with advanced large-area multi-chip semiconductor packaging technologies
  • 5 years of experience with large heterogeneous integration and 2.5-3D packaging techniques
  • 5 years of experience with high-density I/O technologies
  • Experience with photonic packaging and fiber-to-chip coupling is a plus
  • A proven track record of innovation and IP development
  • Experience working within a cross-functional team environment

Responsibilities

  • Develop and implement advanced packaging concepts for mechanical, thermal, electrical, optical, and detection interfaces to next-generation ion traps
  • Develop packaging strategies and processes for large-format ion trap chips with high I/O signal count and density
  • Work with vendors to implement and validate packaging processes
  • Support all stages of ion trap development to ensure compatibility with packaging
  • Interface with broader Quantinuum team to ensure ion trap packaging meets system requirements
  • Engage with 3rd parties to cultivate possible key partnerships, supplier relationships, and co-development opportunities

Benefits

  • Competitive compensation and the opportunity to work on groundbreaking technology
  • Flexible work arrangements that support work-life balance
  • Employer-subsidized medical, dental, and vision insurance
  • 401(k) retirement savings plan with company match and student loan repayment benefit
  • Equity opportunities
  • Generous paid time off, sick leave, and 12 paid holidays annually
  • Paid parental leave
  • Employee discount programs
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