Optomechanical Engineer, Semiconductor Packaging Tools
About The Position
About fab2 The fab2 team can build anything. We design all the hardware and software needed to make chips and we make the fabs, tools, and components ourselves. We're looking for exceptional, hands-on people who can iterate to the limits of what's possible. fab2 was founded by Sam Zeloof and Jim Keller. Sam is best known for making chips in his garage, and Jim has been a leader in the semiconductor industry for the past 40 years. About the role As an Optomechanical Engineer at fab2, you’ll work with a full-stack team to develop the complete set of tools and processes for fabricating semiconductor packaging devices. We are seeking a hands-on engineer with deep expertise in designing laser-based systems and a passion for exploring new technologies. This person will play a critical role in developing hardware and optimizing processes that create innovative packaging solutions, ensuring they meet performance, reliability, and manufacturability requirements. The ideal candidate will have a broad skill set and be open-minded about integrating novel methods into semiconductor packaging processes.
Requirements
- Hands-on experience designing, building, integrating, or fundamentally modifying process equipment or scientific instruments
- Experience with optomechanical system design and integration, including mechanical design, optics, precision assembly, wiring, controls, alignment, and system debug
- Experience developing laser micromachining processes and working with vision-based alignment systems
- Proficiency in metrology and failure analysis, including developing custom tools or methods to quantify process performance and improvement
- Ability to work independently in a fast-moving R&D environment and take ownership from initial concept through functional hardware and validated process results
Nice To Haves
- Experience with metal plating
- Exposure to advanced semiconductor packaging technologies, including interposers, through-vias, redistribution layers (RDL), hybrid bonding, thermocompression bonding, flip chip, and underfill
- Experience with ultrafast laser micromachining
Responsibilities
- Own optomechanical system development from concept through operation, including mechanical design, optical layout, precision assembly, wiring, controls integration, alignment, and debug.
- Develop laser micromachining processes and equipment, including vision-based alignment and inspection systems.
- Create and validate novel IC packaging processes, from early experiments through repeatable multi-step process flows.
- Plan and execute experiments across deposition, etch, lithography, bonding, die attach, and related packaging processes.
- Collaborate closely with process, mechanical, electrical, controls, and software engineers to move quickly from concept to working hardware.
- Create and maintain design documentation, experiment records, operating procedures, and equipment maintenance requirements for safe, reliable, and repeatable operation.
Benefits
- Medical, Dental, and Vision insurance
- Generous Paid Time Off inclusive of Holidays and Sick Time
- Visa Sponsorship
- Life and Disability Insurance
- Paid Parental Leave
- 401(k) retirement plan
- Weekly Learning & Development opportunities
- Commuter Benefits including Parking and Late Night Uber rides from the office
- Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts
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What This Job Offers
Job Type
Full-time
Career Level
Senior
Education Level
No Education Listed
