About The Position

The SOC Thermal Engineer will work closely with cross-functional teams to optimize the thermal performance of mobile devices and contribute to advanced IC packaging research and development. The role includes designing and validating cooling solutions for high-performance computing systems, using simulation and testing, and collaborating across functions to support thermal performance and reliability across product lines.

Requirements

  • Bachelor's degree required.

Nice To Haves

  • Demonstrated leadership capabilities at the senior engineer level.
  • Deep expertise in thermal design for silicon devices and packaging solutions.
  • Proven experience with IC physical design parameters and their impact on electrical and thermal performance across various packaging technologies.
  • Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
  • Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
  • Extensive hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
  • Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products.
  • Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.
  • Experience designing and executing experimental test setups and analyzing thermal data.

Responsibilities

  • Optimize mobile device thermal performance with cross-functional teams.
  • Participate in advanced IC packaging research and development.
  • Design and validate cooling solutions for high-performance computing systems.
  • Use simulation and testing to support thermal performance and reliability across product lines.
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