About The Position

The SOC Thermal Engineer will work closely with multifunctional teams to optimize mobile-device thermal performance and participate in advanced IC packaging research and development. The role involves designing and validating cooling solutions for high-performance computing systems through simulation, testing, and cross-functional collaboration, helping ensure thermal performance and reliability across product lines.

Requirements

  • Bachelor of Science degree and 10 years of industry experience.
  • Demonstrated leadership capabilities at the senior engineer level.
  • Deep expertise in thermal design for silicon devices and packaging solutions.
  • Experience with IC physical design parameters and their impact on electrical and thermal performance across packaging technologies.
  • Strong understanding of SoC design methodologies, low-power design techniques, and thermal analysis approaches.
  • Comprehensive knowledge of advanced packaging assembly processes, including electrical and thermal characteristics.
  • Hands-on experience in thermal design, analysis, and validation of advanced cooling solutions for high-power SoCs.
  • Background in thermal testing for semiconductor devices, packages, PCBs, or mobile products.
  • Proficiency with industry-standard tools including Ansys IcePak, Sentinel-TI, Fluent, Cadence Allegro, and RedHawk.
  • Experience designing and executing experimental test setups and analyzing thermal data.

Nice To Haves

  • Master of Science in Electrical Engineering and 10 years of industry experience.

Responsibilities

  • Optimize mobile-device thermal performance in collaboration with multifunctional teams.
  • Participate in advanced IC packaging research and development.
  • Design and validate cooling solutions for high-performance computing systems.
  • Use simulation and testing to assess thermal performance and reliability across product lines.
  • Design and execute experimental test setups and analyze thermal data.
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