Silicon Packaging Design Engineer

Intel Corporation•Hillsboro, OR

1d•Onsite

About The Position

Drives end-to-end development for silicon packaging substrate design from concept through tapeout and implements physical layout and routing of the package design. Performs substrate fit and routing studies to establish design, performance, and cost tradeoffs. Works closely with silicon and hardware teams to optimize silicon package board performance and pinout. Utilizes and defines substrate design rules, conducts internal and external reviews, analyzes data, and resolves design rules violations to optimize package design. Completes documentation and collaterals into the product lifecycle management system of record. Communicates and responds to customer requests and participates in customer engaging events as they occur. Provides consultation concerning packaging problems and improvements in the packaging process.

Requirements

Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics with 4+ years of experience. Or Master's degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics with 3+ years of experience. Or Phd degree in Electrical Engineering, Mechanical Engineering, Materials Science, or Physics.
Package or board design and review tools like Siemens Xpedition, Cadence Allegro Package Design, Valor NPI, AutoCAD, or SolidWorks.
Expertise in Package Design and Development, interconnect methodologies, and/or manufacturability principles.
Package Fundamentals.

Nice To Haves

Demonstrated ability to collaborate with cross-functional teams and optimize design tradeoffs.
Exceptional analytical skills and a detail-oriented approach to problem-solving.
Prior experience with substrate design rules and DRC resolution.
Excellent communication and documentation skills to manage complex data and technical reviews.
Familiarity with microelectronic package electrical modeling and simulation tools such as PowerDC, HyperLynx, Q3D, and HFSS.
Strong analytical ability and problem-solving skills, including debugging and providing creative solutions.
Experience with scripting using Python, VB, C, or similar languages.

Responsibilities

Perform substrate fit and routing studies to assess design, performance, and cost tradeoffs.
Implement physical layout and routing of package designs, ensuring adherence to design rules.
Optimize silicon-package-board performance and pinout by working closely with silicon and hardware teams.
Define substrate design rules and conduct internal and external design reviews.
Analyze data and resolve design rule checks (DRCs) to refine package designs.
Drive design-for-manufacturability (DFM) strategies to enhance manufacturability and cost efficiency.
Develop comprehensive documentation and collateral, storing them in the product lifecycle management system of record.
Team player with experience collaborating with customers
Communication and stakeholder management skills