Silicon Photonics & Optical Packaging Engineer

Apple

23h

About The Position

Silicon photonics (SiPh) technology is essential for realizing next-generation optical interconnects already implemented in data center connectivity and ready to penetrating into short distance within the boards. One critical technology to realize high-volume, low-cost SiPh optical interconnect applications is the development of high efficient optical I/O module architecture, assembly, optical coupling design and process for single-mode fiber packaging. We are looking for a hardworking and passionate Si photonics & optical Packaging Engineer to join our team. In this highly visible role, you will develop Si photonics engine/chiplet packaging and co-packaging solutions utilizing advanced packaging technologies, define assembly baseline processes, decide package BOM, establish optical coupling design/manufacturing that are optimized for performance, reliability, yield and cost.

Requirements

• Minimum requirement of a bachelors degree

Nice To Haves

• M.S or Ph.D. in Physic (Optics major), Electrical Engineering, Materials Science, Mechanical Engineering or an equivalent field desired, preferred.
• Excellent teamwork and communication skills.
• Strong theoretical background in optics and photonics fundamentals, device/module integration.
• Hands-on experience in packaging and measuring fiber-coupled devices.
• Hands-on experience in optical component design, simulation and qualification, and single / multi-mode fiber assembly using active and passive alignment tool.
• Min. 5 years works experiences in the related field with M.S and or Ph.D.
• Hands-on experience of CMOS BEOL wafer scale processing and flip chip assembly (CoC, CoW, WLP, …)
• Experience with silicon photonics device laser, modulator, PD, passive components, such as, Si WG, MUX/DeMUX is a plus.

Responsibilities

• Responsible to support Si photonics packaging technology development.
• Work with cross functional team and support optical engine module, optical coupling design/fiber array connector and co-packaging optics development efforts.
• Si photonics based optical engine package architecture / Package integration and drive micro-optical component assembly/interface characterization through Innovation
• Work with optical component vendors, foundry and OSAT to bring Si photonics packaging solution from concept to HVM.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Number of Employees: 5,001-10,000 employees