Signal Integrity and Power Integrity Designer

Fidus Systems

2h•$105,000 - $155,000

About The Position

The Senior Signal Integrity and Power Integrity Specialist plays a critical role in ensuring the performance, reliability, and compliance of high-speed electronic systems designed by Fidus. You will lead and support SI/PI analysis from early architecture through final validation, working closely with hardware designers, PCB layout, FPGA, and system teams to optimize signal quality and power distribution. This role is ideal for someone who thrives on solving complex high-speed challenges, enjoys working across multiple industries, and takes pride in delivering robust, production-ready designs backed by strong analytical and lab validation skills. At Fidus, you’ll work on complex, high-speed systems across a diverse set of industries including telecommunications, wireless devices, biomedical instruments, avionics, maritime, and more . You’ll contribute to projects ranging from evaluation boards and reference designs to high-speed backplanes and systems involving DDR memory interfaces and SERDES . Your work will directly influence product performance, manufacturability, and compliance. In practice, this means engaging from early concept and stack-up definition through simulation, layout guidance, lab validation, and final product release. You won’t be limited to a single application domain — you’ll work where the technology demands deep SI/PI expertise.

Requirements

MS or PhD in Electrical/Electronics Engineering
Minimum five (5) years of experience designing and analyzing high-speed circuits or RF structures
Strong background in signal integrity, power integrity, electromagnetics, RF, antennas, or EMC
Hands-on experience with high-speed interfaces such as DDR memory and SERDES
Proficiency with SI/PI simulation and analysis tools such as Cadence Sigrity, HSPICE, ADS, HFSS, and Hyperlynx
Solid lab validation experience using tools such as TDR, vector network analyzers, spectrum analyzers, and high-speed oscilloscopes
Strong communication skills with the ability to interact effectively with customers and cross-functional teams
Comfortable adapting to new technologies and working across diverse industries
Committed to disciplined engineering practices and delivering high-quality designs

Responsibilities

Lead PCB layer stack-up design and optimization
Perform waveform integrity, crosstalk, timing, eye diagram, and jitter analysis
Conduct power integrity analysis including DC IR drop and decoupling strategy optimization
Model insertion and return loss and support EMC analysis
Use industry tools such as Cadence Sigrity, HSPICE, ADS, HFSS, and Hyperlynx for simulation and analysis
Support and execute lab validation using TDR, vector network analyzers, spectrum analyzers, and high-speed oscilloscopes
Estimate turnkey projects and execute work from concept through development, lab testing, and final product delivery
Collaborate with cross-functional teams including hardware, layout, FPGA, and system engineers to ensure SI/PI best practices are embedded early in the design cycle