Package Development, Signal Integrity and Power Integrity Engineer, Staff
About The Position
Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development. What You Can Expect Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
Requirements
- Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master’s/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience.
- Strong fundamentals in EM, transmission lines and microwave theory
- Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
- Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.
- Familiarity with IC package layout tools like APD or PADS
- Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
- Working knowledge of circuit design tools: Spectre, ADS, HSpice
- Experience with VNA and TDR measurements for package and PCB characterization
- Frequency domain and time domain knowledge of high speed signaling
- Experience with high-speed electronic packaging for digital and analog ICs
- Power plane design, modeling and analysis using tools like PowerSI, SIwave
- Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
- Understanding, debugging and simulations of EMI/EMC problems
- A team player
- Strong communication, presentation, and documentation skills
Nice To Haves
- Experience with 2.5D/3D package development is highly desired.
- Track record of new product introduction from concept, through development and production is a plus.
- Knowledge of the thermal and mechanical analysis of the IC package development is a plus.
- Experience with channel simulations using MATLAB or ADS or other tools is a plus.
Responsibilities
- package development
- electrical design
- modeling
- characterization
- signal and power integrity aspects while considering manufacturing and assembly tolerances
- interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements
- interface with marketing and IC designers to develop achievable package specs
- contribute to new package technology development
Benefits
- employee stock purchase plan with a 2-year look back
- family support programs to help balance work and home life
- robust mental health resources to prioritize emotional well-being
- recognition and service awards to celebrate contributions and milestones
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
