Package Development, Signal Integrity and Power Integrity Engineer, Staff
About The Position
Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
Requirements
- Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master’s/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience.
- Strong fundamentals in EM, transmission lines and microwave theory
- Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
- Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.
- Familiarity with IC package layout tools like APD or PADS
- Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
- Working knowledge of circuit design tools: Spectre, ADS, HSpice
- Experience with VNA and TDR measurements for package and PCB characterization
- Frequency domain and time domain knowledge of high speed signaling
- Experience with high-speed electronic packaging for digital and analog ICs
- Power plane design, modeling and analysis using tools like PowerSI, SIwave
- Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
- Understanding, debugging and simulations of EMI/EMC problems
- A team player
- Strong communication, presentation, and documentation skills
Nice To Haves
- Experience with 2.5D/3D package development is highly desired.
- Track record of new product introduction from concept, through development and production is a plus.
- Knowledge of the thermal and mechanical analysis of the IC package development is a plus.
- Experience with channel simulations using MATLAB or ADS or other tools is a plus.
Responsibilities
- Package development
- Electrical design, modeling, and characterization, including all signal and power integrity aspects while considering manufacturing and assembly tolerances.
- Interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements.
- Interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.
Benefits
- employee stock purchase plan with a 2-year look back
- family support programs
- robust mental health resources
- recognition and service awards
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What This Job Offers
Job Type
Full-time
Career Level
Senior
