Senior Systems Applications Engineer

NXP Semiconductors•Austin, TX

About The Position

NXP is hiring a Senior Systems Applications Engineer to support its i.MX application processors and current and emerging memory technologies, including LPDDR4/4X/5/5x, DDR5, and LPDDR6. The role is part of NXP’s global Systems Engineering organization and works closely with the Global DDR Core Team, customers, memory suppliers, silicon architects, and software teams to address system challenges and drive products from concept through production. The Microprocessor Systems Engineering team connects customers with NXP’s architecture, silicon design, software, validation, and product management organizations. Based in Austin, Texas, the team supports customers across the i.MX processor portfolio, strategic product introductions, and future embedded computing platforms. The engineer will contribute to customer product deployment and help inform future processor and memory subsystem architectures and roadmaps.

Requirements

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
  • At least 5 years of experience with embedded SoCs or application processors.
  • Strong knowledge of DDR memory technologies, including LPDDR4X, LPDDR5/5x, DDR5, memory controllers, and PHY architectures.
  • Experience with DDR bring-up, training, margin analysis, validation, and debugging.
  • Experience reviewing high-speed schematics and PCB layouts.
  • Strong understanding of hardware/software interactions in embedded systems.
  • Experience with Linux, U-Boot, device drivers, and low-level firmware development, with proficiency in C programming.
  • Experience using oscilloscopes, logic analyzers, JTAG debuggers, protocol analyzers, and related debugging tools.
  • Strong customer-facing communication and technical problem-solving skills.

Nice To Haves

  • Experience supporting MPU or application processor customers.
  • Experience with LPDDR6, DDR5, advanced memory architectures, or memory subsystem design.
  • Experience working directly with memory suppliers and ecosystem partners.
  • Familiarity with PCIe, UFS, eMMC, Ethernet, USB, MIPI, and other high-speed interfaces.
  • Knowledge of signal integrity, power integrity, and system performance optimization.
  • Experience influencing SoC architecture, product definition, or platform strategy.
  • Familiarity with AI/ML, multimedia, graphics, industrial, automotive, networking, or edge computing applications.

Responsibilities

  • Serve as a technical expert for i.MX processors, DDR memory technologies, and system architecture.
  • Support strategic customers through design-in, board bring-up, production ramp, and complex system-level debugging.
  • Help deploy products across industrial, automotive, IoT, AI, networking, and consumer markets.
  • Work with current and emerging memory technologies, including LPDDR4/4X, LPDDR5/5x, DDR5, and LPDDR6.
  • Collaborate with memory vendors and ecosystem partners to evaluate future memory architectures and platform requirements.
  • Engage with architects and product teams to influence next-generation processor and memory subsystem roadmaps.
  • Debug performance, reliability, power, boot, interoperability, and memory subsystem issues across hardware and software domains.
  • Analyze DDR controller, PHY, and high-speed interface behavior to optimize system performance and robustness.
  • Support silicon bring-up, characterization, and root-cause analysis of customer and new product introduction issues.
  • Conduct architecture, schematic, and design reviews for strategic customers.
  • Develop reference designs, design guidelines, application notes, and technical training materials.
  • Advise customers bringing next-generation products to market.

Benefits

  • Opportunity to work on i.MX processors for next-generation edge devices.
  • Opportunity to influence adoption of LPDDR6, AI-enabled edge computing, and advanced memory architectures.
  • Collaboration with experts across NXP’s global processor and memory organizations.
  • Direct engagement with innovative technology companies.
  • Opportunity to contribute to products from initial concept through customer deployment.
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